MANUFACTURING METHOD OF ELECTRONIC COMPONENT

To provide a manufacturing method of an electronic component that can reduce damage to an electronic component and easily peel off a support even when subjected to heat treatment or treatment that generates heat.SOLUTION: A manufacturing method of an electronic component includes a support fixing st...

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Bibliographische Detailangaben
Hauptverfasser:	DAIDO IZUMI, YAMAZAWA CHIEKO, NISHIUMI YUKI, SHICHIRI NORISHIGE, HAYASHI SATOSHI, OKAYAMA HISATOSHI, TAKAHASHI TOSHIO
Format:	Patent
Sprache:	eng ; jpn
Schlagworte:	ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE ADHESIVES BASIC ELECTRIC ELEMENTS CHEMISTRY COMPOSITIONS BASED THEREON DYES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS METALLURGY MISCELLANEOUS APPLICATIONS OF MATERIALS MISCELLANEOUS COMPOSITIONS NATURAL RESINS NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL ORGANIC MACROMOLECULAR COMPOUNDS PAINTS POLISHES SEMICONDUCTOR DEVICES THEIR PREPARATION OR CHEMICAL WORKING-UP USE OF MATERIALS AS ADHESIVES
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Beschreibung
Zusammenfassung:	To provide a manufacturing method of an electronic component that can reduce damage to an electronic component and easily peel off a support even when subjected to heat treatment or treatment that generates heat.SOLUTION: A manufacturing method of an electronic component includes a support fixing step of fixing an electronic component to a support via a polyimide temporary fixing material, a treatment step of subjecting the electronic component fixed to the support to heat treatment or a treatment that generates heat, and a support peeling step of peeling the support from the electronic component by irradiating with a laser beam from the support side.SELECTED DRAWING: None 【課題】加熱処理又は発熱を伴う処理が施された場合であっても、電子部品の損傷を低減し、かつ、支持体を容易に剥離することができる電子部品の製造方法を提供する。【解決手段】ポリイミド系仮固定材を介して、電子部品を支持体に固定する支持体固定工程と、前記支持体に固定された電子部品に加熱処理又は発熱を伴う処理を施す処理工程と、前記支持体側からレーザー光を照射し、前記電子部品から支持体を剥離する支持体剥離工程とを有する電子部品の製造方法。【選択図】なし