WORKPIECE INSPECTION METHOD AND INSPECTION DEVICE

To provide a workpiece inspection method and inspection device with which it is possible to determine a peeling layer formed in the inside of an ingot, without lowering productivity, and without being affected by saw marks.SOLUTION: The workpiece inspection method comprises: a peeling layer formatio...

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Bibliographische Detailangaben
1. Verfasser:	IGA YUTO
Format:	Patent
Sprache:	eng ; jpn
Schlagworte:	BASIC ELECTRIC ELEMENTS CLADDING OR PLATING BY SOLDERING OR WELDING CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIRCHEMICAL OR PHYSICAL PROPERTIES MACHINE TOOLS MEASURING METAL-WORKING NOT OTHERWISE PROVIDED FOR PERFORMING OPERATIONS PHYSICS SEMICONDUCTOR DEVICES SOLDERING OR UNSOLDERING TESTING TRANSPORTING WELDING WORKING BY LASER BEAM
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