ETHYLENE RESIN COMPOSITION, MOLDED ARTICLE, FILM AND MULTILAYER FILM

To provide an ethylene resin composition that yields a molded article capable of being heat-sealed at lower temperatures compared to conventional ethylene resin-based films, and demonstrates superior moldability, blocking resistance, and transparency.SOLUTION: An ethylene resin composition (Z) compr...

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Bibliographische Detailangaben
Hauptverfasser: AMANO TAIGA, TAMURA NAOYA, TANAKA YOICHI, NAMITO KAZUTERU, MATSUBARA SHINYA, TAKAICHI KEISUKE, YOSHINO SHOTA, TATSUMI SHUHEI
Format: Patent
Sprache:eng ; jpn
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