MOLDED CIRCUIT COMPONENT
To provide a solder bridge prevention structure that excels in productivity and in cost, for molded circuit components by MID technology that do not have solder resist.SOLUTION: The molded circuit components according to the present invention pertain to molded circuit components 503, 5032 in which p...
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| Format: | Patent |
| Sprache: | eng ; jpn |
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| Zusammenfassung: | To provide a solder bridge prevention structure that excels in productivity and in cost, for molded circuit components by MID technology that do not have solder resist.SOLUTION: The molded circuit components according to the present invention pertain to molded circuit components 503, 5032 in which pattern wiring 500 is formed by injection molding on base members 503, 5032 that are made of resin. The molded circuit components 503, 5032 are characterized in that a plurality of mounting lands 600 for mounting an electric element 501P by solder bonding are formed by the pattern wiring, and in a region where the distance between two adjacent mounting lands 600 out of the plurality of mounting lands 600 is closest, a recess 601 or a protrusion 602 is formed on a plane of the base members 503, 5032 where the mounting lands 600 are formed.SELECTED DRAWING: Figure 7
【課題】 ソルダレジストを有しないＭＩＤ技術による成形回路部品において、生産性及びコストの点で優れたはんだブリッジ防止構造を提供すること。【解決手段】 本発明による成形回路部品は、パターン配線５００が樹脂製のベース部材５０３、５０３２に射出成形にて成形された成形回路部品５０３、５０３２であって、前記成形回路部品５０３、５０３２は、電気素子５０１Ｐをはんだ接合により実装するための複数の実装ランド６００が前記パターン配線により成形されており、前記複数の実装ランド６００のうち隣接する二つの実装ランド６００の距離が最も近い領域において、前記ベース部材５０３、５０３２の前記実装ランド６００が成形されている面に対し凹部６０１又は凸部６０２が成形されていることを特徴とする。【選択図】 図７ |
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