CURABLE RESIN COMPOSITION, CURED FILM, LAMINATE, IMAGING DEVICE, SEMICONDUCTOR DEVICE, MANUFACTURING METHOD OF LAMINATE, AND MANUFACTURING METHOD OF ELEMENT HAVING JOINT ELECTRODE

To provide a curable resin composition which flattens a connection surface and connects elements without a gap even in the case of having unevenness on the element surface, and can impart high connection reliability between the elements, a cured film using the curable resin composition, a laminate having the cured film, an imaging device and a semiconductor device having the laminate, a manufacturing method of the laminate, and a manufacturing method of an element having a joint electrode used in manufacture of the laminate.SOLUTION: A curable resin composition contains an organosilicon compound and a solvent, has viscosity at 25°C of 2,000 cP or less, has a content of the solvent of 50 wt.% or less, and has adhesion by a crosscutting method measured according to JIS K 5600-5-6 in a measurement sample formed by spin-coating the solvent on a silicon wafer, drying the solvent, then thermally curing the solvent at 300°C for one hour of 0 to 2 points.SELECTED DRAWING: None 【課題】素子表面に凹凸を有する場合であっても接続面を平坦化し表面の空隙なく素子を接続し、素子間に高い接合信頼性を付与することができる硬化性樹脂組成物、該硬化性樹脂組成物を用いた硬化膜、該硬化膜を有する積層体、該積層体を有する撮像装置及び半導体装置、該積層体の製造方法及び該積層体の製造に用いる接合電極を有する素子の製造方法を提供する。【解決手段】本発明は、有機ケイ素化合物及び溶剤を含有する硬化性樹脂組成物であって、２５℃における粘度が２０００ｃＰ以下であり、前記溶剤の含有量が５０重量％以下であり、シリコンウエハ上にスピンコートし前記溶剤を乾燥させた後に３００℃１時間で熱硬化させ成膜した測定サンプルにおいてＪＩＳ Ｋ５６００－５－６に準拠して測定したクロスカット法による密着性が０～２点である硬化性樹脂組成物。【選択図】なし