FLEXIBLE PRINTED WIRING BOARD AND MANUFACTURING METHOD THEREOF

To provide a flexible printed wiring board which has excellent flexibility, can reduce electrical resistance, and can save space, and a manufacturing method thereof.SOLUTION: A flexible printed wiring board according to an embodiment of the present invention includes an insulating base film, and one...

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Bibliographische Detailangaben
Hauptverfasser:	OKAUE JUNICHI, MOCHIDA YASUSHI, OKA YOSHIO, KAIBUKI TADAHIRO, SAKAI SHOICHIRO, NITTA KOJI
Format:	Patent
Sprache:	eng ; jpn
Schlagworte:	APPARATUS THEREFOR CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS CHEMISTRY ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY ELECTROFORMING ELECTROLYTIC OR ELECTROPHORETIC PROCESSES MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS METALLURGY PRINTED CIRCUITS PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTIONOF COATINGS
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Beschreibung
Zusammenfassung:	To provide a flexible printed wiring board which has excellent flexibility, can reduce electrical resistance, and can save space, and a manufacturing method thereof.SOLUTION: A flexible printed wiring board according to an embodiment of the present invention includes an insulating base film, and one or more wires laminated on at least one surface side of the base film, and the wire includes one or more first portions in the longitudinal direction thereof, and one or more second portions having an average thickness larger than the average thickness of the first portion other than the first portion. The ratio of the average thickness of the second portion to the average thickness of the first portion is 1.5 or more and 50 or less.SELECTED DRAWING: Figure 1 【課題】本発明は、優れた可撓性を有し、電気抵抗を小さくすることができ、かつ省スペース化を図ることができるフレキシブルプリント配線板及びその製造方法を提供することを目的とする。【解決手段】本発明の一態様のフレキシブルプリント配線板は、絶縁性を有するベースフィルムと、上記ベースフィルムの少なくとも一方の面側に積層される１本又は複数本の配線とを備えるフレキシブルプリント配線板であって、上記配線が、その長手方向における１又は複数の第１部分と、上記第１部分以外の部分であって上記第１部分の平均厚みよりも大きい平均厚みを有する１又は複数の第２部分とを有し、上記第１部分の平均厚みに対する上記第２部分の平均厚みの比率が１．５以上５０以下である。【選択図】図１