SUBSTRATE PROCESSING APPARATUS

To provide a substrate processing apparatus in which an adjustment of an exhaust amount of a whole device is facilitated.SOLUTION: A substrate processing apparatus comprises: a nozzle 310 that supplies processing liquid to a substrate W; a movement part that moves the nozzle 310 between a supply pos...

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Bibliographische Detailangaben
1. Verfasser:	KOMORI JUN
Format:	Patent
Sprache:	eng ; jpn
Schlagworte:	APPARATUS SPECIALLY ADAPTED THEREFOR BASIC ELECTRIC ELEMENTS CINEMATOGRAPHY ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY ELECTROGRAPHY HOLOGRAPHY MATERIALS THEREFOR ORIGINALS THEREFOR PHOTOGRAPHY PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES,e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTORDEVICES PHYSICS SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:	To provide a substrate processing apparatus in which an adjustment of an exhaust amount of a whole device is facilitated.SOLUTION: A substrate processing apparatus comprises: a nozzle 310 that supplies processing liquid to a substrate W; a movement part that moves the nozzle 310 between a supply position above the substrate W and a standby position outside the substrate W; a nozzle housing device 500 that is positioned at the standby position, and houses the nozzle 310; a first exhaust channel that guides an exhaust device X1 of air in a processing space in which the processing liquid is supplied to the substrate W; and a second exhaust channel that guides the air in the nozzle housing device to the first exhaust channel.SELECTED DRAWING: Figure 4 【課題】装置全体の排気量の調整を容易にした基板処理装置を提供する【解決手段】基板処理装置は、基板Ｗに処理液を供給するノズル３１０と、基板Ｗの上方の供給位置と基板Ｗの外方の待機位置との間でノズル３１０を移動させる移動部と、待機位置に位置し、ノズル３１０を収容するノズル収容器５００と、基板Ｗに処理液が供給される処理空間内の気体を排気装置Ｘ１に導く第１の排出流路と、ノズル収容器内の気体を第１の排出流路に導く第２の排出流路とを備える。【選択図】図４