VERTICAL LED DIE PACKAGING METHOD

To effectively replace the existing external wire bonding process by adopting a vertical light emitting diode (LED) die packaging method to meet the needs of die size miniaturization and to improve the LED packaging yield rate.SOLUTION: The vertical LED die packaging method is to fix and install a p...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	CHEN HSIAO-LU, LIU AI SEN, FENG HSIANG AN
Format:	Patent
Sprache:	eng ; jpn
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
Online-Zugang:	Volltext bestellen
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