MEASURING DEVICE AND PROCESSING DEVICE

To provide a measuring device and a processing device that can accurately measure the shape and/or roughness of the surface of a workpiece.SOLUTION: A measuring device 1 includes a table 10 on which a wafer W is placed, a first imaging unit 100 for imaging the surface of the wafer W on the table 10 by magnifying the surface of the wafer W, a second imaging unit 200 for imaging the surface of the wafer W on the table 10 and capable of measuring the shape and/or roughness of the surface of the wafer W from a plurality of images captured by scanning the surface of the wafer W in the Z-axis direction, and an image processing unit 310 for measuring the shape and/or roughness of the surface of the wafer W by processing an image captured of the surface of the wafer W by the first imaging unit 100 and a plurality of images captured by the second imaging unit 200 by scanning the surface of the wafer W in the Z-axis direction.SELECTED DRAWING: Figure 1 【課題】ワークの表面の形状及び／又は粗さを精度よく測定できる測定装置及び加工装置を提供する。【解決手段】測定装置１は、ウェーハＷが載置されるテーブル１０と、テーブル１０上のウェーハＷの表面を拡大して撮像する第１撮像部１００と、テーブル１０上のウェーハＷの表面を撮像する第２撮像部２００であって、ウェーハＷの表面をＺ軸方向に走査して撮像した複数の画像からウェーハＷの表面の形状及び／又は粗さの測定が可能な第２撮像部２００と、第１撮像部１００でウェーハＷの表面を撮像した画像、及び、第２撮像部２００でウェーハＷの表面をＺ軸方向に走査して撮像した複数の画像を処理して、ウェーハＷの表面の形状及び／又は粗さを測定する画像処理部３１０と、を備える。【選択図】図１