FLUX COMPOSITION, SOLDER COMPOSITION, AND ELECTRONIC SUBSTRATE

To provide a flux composition which can sufficiently suppress occurrence of a solder ball regardless of a halogen free or non-halogen type.SOLUTION: A flux composition contains (A) a resin and (B) an activator, wherein the component (B) contains (B1) a compound having a quinoline skeleton.SELECTED D...

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Bibliographische Detailangaben
1. Verfasser:	SUGIYAMA ISAO
Format:	Patent
Sprache:	eng ; jpn
Schlagworte:	ALLOYS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS CHEMISTRY CLADDING OR PLATING BY SOLDERING OR WELDING CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY FERROUS OR NON-FERROUS ALLOYS MACHINE TOOLS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS METAL-WORKING NOT OTHERWISE PROVIDED FOR METALLURGY PERFORMING OPERATIONS PRINTED CIRCUITS SOLDERING OR UNSOLDERING TRANSPORTING TREATMENT OF ALLOYS OR NON-FERROUS METALS WELDING WORKING BY LASER BEAM
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Beschreibung
Zusammenfassung:	To provide a flux composition which can sufficiently suppress occurrence of a solder ball regardless of a halogen free or non-halogen type.SOLUTION: A flux composition contains (A) a resin and (B) an activator, wherein the component (B) contains (B1) a compound having a quinoline skeleton.SELECTED DRAWING: None 【課題】ハロゲンフリーまたはノンハロゲンタイプであるにも拘わらず、はんだボールの発生を十分に抑制できるフラックス組成物を提供すること。【解決手段】（Ａ）樹脂、および（Ｂ）活性剤を含有し、前記（Ｂ）成分が、（Ｂ１）キノリン骨格を有する化合物を含有する、フラックス組成物。【選択図】なし