TIM FILM AND SEMICONDUCTOR PACKAGES MANUFACTURED USING THE SAME

To provide a TIM film and a semiconductor package manufactured using the same.SOLUTION: A semiconductor package according to the present invention includes a first semiconductor chip and a second semiconductor chip arranged laterally on a first substrate, a thermally conductive adhesive layer dispos...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: LEE CHIWOO, PARK MIHYAE
Format: Patent
Sprache:eng ; jpn
Schlagworte:
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