TIM FILM AND SEMICONDUCTOR PACKAGES MANUFACTURED USING THE SAME

To provide a TIM film and a semiconductor package manufactured using the same.SOLUTION: A semiconductor package according to the present invention includes a first semiconductor chip and a second semiconductor chip arranged laterally on a first substrate, a thermally conductive adhesive layer disposed on the first semiconductor chip and the second semiconductor chip and including a resin layer and a first heat dissipating filler containing liquid metal contained in the resin layer, and a heat dissipating member on the thermally conductive adhesive layer.SELECTED DRAWING: Figure 1 【課題】ＴＩＭフィルム及びこれを用いて製造された半導体パッケージを提供する。【解決手段】本発明の半導体パッケージは、第１基板上で側方向に配列された第１半導体チップ及び第２半導体チップと、第１半導体チップ及び第２半導体チップ上に配置され、樹脂層及び樹脂層に含有されて液体金属を含む第１放熱フィラーを含む熱伝導性接着層と、熱伝導性接着層上の放熱部材と、を備える。【選択図】図１