COIL COMPONENT

To reduce connection resistance in a two-terminal type coil component with a single coil conductor incorporated in an element body.SOLUTION: A coil component 100 comprises: a coil conductor embedded in an element body 110; a bump conductor 131 which is connected to one end of the coil conductor, and...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: ENDO MASATERU, MIURA MITSURU, NISHIKAWA TOMONAGA, MOTOHASHI TORU, YONEKURA EISUKE
Format: Patent
Sprache:eng ; jpn
Schlagworte:
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Beschreibung
Zusammenfassung:To reduce connection resistance in a two-terminal type coil component with a single coil conductor incorporated in an element body.SOLUTION: A coil component 100 comprises: a coil conductor embedded in an element body 110; a bump conductor 131 which is connected to one end of the coil conductor, and is exposed to a mounting surface S0 and side surfaces S1 and S3; a bump conductor 132 exposed to the mounting surface S0 and side surfaces S2 and S3; a dummy bump conductor 141 exposed to the mounting surface S0 and side surfaces S1 and S4; a dummy bump conductor 142 exposed to the mounting surface S0 and side surfaces S2 and S4; a conductive resin layer 121 connecting between the bump conductor 131 and the dummy bump conductor 141; and a conductive resin layer 122 connecting between the bump conductor 132 and the dummy bump conductor 142. At least a part of a side surface portion of the bump conductors 131 and 132 is not covered with the conductive resin layers 121 and 122, and thus, a connection resistance of this portion is reduced.SELECTED DRAWING: Figure 1 【課題】素体に単一のコイル導体が内蔵された2端子型のコイル部品において接続抵抗を低減する。【解決手段】コイル部品100は、素体110に埋め込まれたコイル導体と、コイル導体の一端に接続され、実装面S0及び側面S1,S3に露出するバンプ導体131と、実装面S0及び側面S2,S3に露出するバンプ導体132と、実装面S0及び側面S1,S4に露出するダミーバンプ導体141と、実装面S0及び側面S2,S4に露出するダミーバンプ導体142と、バンプ導体131とダミーバンプ導体141を接続する導電性樹脂層121と、バンプ導体132とダミーバンプ導体142を接続する導電性樹脂層122とを備える。バンプ導体131,132の側面部分は、少なくとも一部が導電性樹脂層121,122で覆われておらず、この部分において接続抵抗が低減される。【選択図】図1