ABNORMALITY DETECTION DEVICE, AND MACHINING SYSTEM

To provide a technique that can prevent a reduction in abnormality detection accuracy.SOLUTION: An abnormality detection device 11 is a device for grinding device 2 that performs grinding processing on a workpiece W. The abnormality detection device 11 comprises: a sound collection microphone 10 tha...

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Bibliographische Detailangaben
Hauptverfasser:	GOTO MAKIO, OKINO YUSUKE
Format:	Patent
Sprache:	eng ; jpn
Schlagworte:	COMBINATIONS OR ASSOCIATIONS OF METAL-WORKING MACHINES, NOTDIRECTED TO A PARTICULAR RESULT CONTROL OR REGULATING SYSTEMS IN GENERAL CONTROLLING DETAILS, COMPONENTS, OR ACCESSORIES FOR MACHINE TOOLS, e.g.ARRANGEMENTS FOR COPYING OR CONTROLLING DRESSING OR CONDITIONING OF ABRADING SURFACES FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS FUNCTIONAL ELEMENTS OF SUCH SYSTEMS GRINDING MACHINE TOOLS MACHINE TOOLS IN GENERAL CHARACTERISED BY THE CONSTRUCTION OFPARTICULAR DETAILS OR COMPONENTS MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING METAL-WORKING NOT OTHERWISE PROVIDED FOR MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS ORELEMENTS PERFORMING OPERATIONS PHYSICS POLISHING REGULATING TRANSPORTING
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Beschreibung
Zusammenfassung:	To provide a technique that can prevent a reduction in abnormality detection accuracy.SOLUTION: An abnormality detection device 11 is a device for grinding device 2 that performs grinding processing on a workpiece W. The abnormality detection device 11 comprises: a sound collection microphone 10 that collects the sound of the grinding device 2; and a processor 4 that is provided with output from the sound collection microphone 10. The processor 4 includes a processing unit 14 that executes acquisition processing 14a of acquiring sound data based on the output of the sound collected in a grinding processing period P2 from the start to the end of the grinding processing and a non-processing period other than the grinding processing period P2, and abnormality determination processing 14c of determining the presence or absence of abnormality based on the sound data.SELECTED DRAWING: Figure 4 【課題】異常検知精度の低下を抑制することができる技術を提供する。【解決手段】異常検知装置１１は、ワークＷに対する研削加工処理を行う研削加工装置２用の装置である。異常検知装置１１は、研削加工装置２の音を集音する集音マイク１０と、集音マイク１０の出力が与えられる処理装置４と、を備える。処理装置４は、研削加工処理の開始から終了までの研削加工処理期間Ｐ２及び研削加工処理期間Ｐ２以外の非加工処理期間において集音された前記出力に基づいて音データを取得する取得処理１４ａと、音データに基づいて異常の有無を判定する異常判定処理１４ｃと、を実行する処理部１４を備える。【選択図】図４