SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME

To provide a semiconductor device that has improved secondary mounting reliability.SOLUTION: A semiconductor device comprises: a lead frame that includes a bed part and first lead parts; an organic material that extends between the bed part and the first lead parts; a first semiconductor element that is above an upper part of the bed part; a sealing resin that is above the organic material and the first semiconductor element; and first bonding wires that connect electrodes of the first semiconductor element and the first lead parts to each other. The first bonding wires are in the sealing resin. The first lead parts each include a lead upper side, a lead bottom side on the opposite side of the lead upper side, inner side faces, and outer side faces on the opposite side of the inner side faces. The first bonding wires are joined to the lead upper sides. The length of the lead upper side and the length of the lead bottom side are different from each other.SELECTED DRAWING: Figure 2-1 【課題】本発明は、二次実装信頼性を向上させた半導体装置を提供することを目的とする。【解決手段】半導体装置は、ベッド部と第１リード部を含むリードフレームと、前記ベッド部と前記第１リード部との間に延在する有機材料と、前記ベッド部の上側の上方の第１半導体素子と、前記有機材料及び前記第１半導体素子の上方の封止樹脂と、前記第１半導体素子の電極と前記第１リード部とを接続する第１ボンディングワイヤと、を備え、前記第１ボンディングワイヤは、前記封止樹脂内にあり、前記第１リード部は、リード上側、前記リード上側の反対側のリード底側、内部側面、及び前記内部側面の反対側の外部側面を含み、第１ボンディングワイヤは、前記リード上側に結合され、前記リード上側の長さは、前記リード底側の長さとは異なる。【選択図】図２－１