METHOD FOR REPAIRING PRINTED CIRCUIT BOARD AND METHOD FOR MANUFACTURING RECYCLED PRINTED CIRCUIT BOARD

To provide a method for repairing a printed circuit board and a method for manufacturing a recycled printed circuit board.SOLUTION: A method for repairing a printed circuit board on which a pad 110 or a pattern is damaged or peeled off, includes: an application step of applying a photoresist 410 to a predetermined range of a printed circuit board 100; an exposure step of, after the application step, performing exposure by using layout data of a circuit pattern of a repair portion to plate the circuit pattern; a developing step of, after the exposure step, removing an unnecessary part of the photoresist 410 by using developer; a plating step of, after the developing step, plating the predetermined range of the printed circuit board with a metal having conductivity; and a shaving step of, after the plating step, shaving the predetermined range until the predetermined range becomes flat.SELECTED DRAWING: Figure 14 【課題】プリント配線板の修理方法及び再生プリント配線板の製造方法を提供する。【解決手段】パッド１１０又はパターンが損傷又は剥離したプリント配線板の修理方法であって、プリント配線板１００の所定範囲に対してフォトレジスト４１０を塗布する塗布工程と、塗布工程後、修理箇所の回路パターンのレイアウトデータを使用して露光し、回路パターンを焼き付ける露光工程と、露光工程後、現像液によって不要なフォトレジスト４１０部分を除去する現像工程と、現像工程後、プリント配線板の所定範囲を、導電性を有する金属でメッキをするメッキ工程と、メッキ工程後、所定範囲を削り、所定範囲が平坦になるまで削る削り工程と、を含む。【選択図】図１４