SEMICONDUCTOR DEVICE, MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE AND ARRANGEMENT METHOD OF ALIGNMENT MARKS

To provide a semiconductor device which can more properly bond chips, a manufacturing method of the semiconductor device, and an arrangement method of alignment marks.SOLUTION: A semiconductor device according to the present embodiment includes a first chip and a second chip which is bonded to the f...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	MATSUSHIGE HIDEKI, YAMAMOTO SUSUMU, TOYODA GEN
Format:	Patent
Sprache:	eng ; jpn
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
Online-Zugang:	Volltext bestellen
Tags:	Tag hinzufügen Keine Tags, Fügen Sie den ersten Tag hinzu!