SEMICONDUCTOR MANUFACTURING APPARATUS AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE

To provide a semiconductor manufacturing apparatus that can transport a semiconductor wafer and prevents sputtering particles from wrapping around a non-sputtering surface of the semiconductor wafer during sputtering.SOLUTION: A semiconductor manufacturing apparatus includes: a support member 7 capable of mounting a semiconductor wafer 2 thereon; and a transportation jig 3. The transportation jig 3 is disposed while being spaced apart from an outer periphery of the semiconductor wafer 2 mounted to the support member 7. The semiconductor wafer 2 mounted to the support member 7 has a non-sputtering surface 2b facing the support member 7. The transportation jig 3 includes a soft member 8. The soft member 8 is disposed so as to prevent sputtering particles from adhering to the non-sputtering surface 2b of the semiconductor wafer 2 mounted to the support member 7 during sputtering.SELECTED DRAWING: Figure 1 【課題】半導体ウエハを搬送できるとともに、スパッタ処理中にスパッタ粒子による半導体ウエハの非スパッタ面への回り込みを防止する半導体製造装置を提供する。【解決手段】半導体ウエハ２を搭載可能な支持部材７と、搬送治具３とを備える。搬送治具３は、支持部材７に搭載された半導体ウエハ２の外周に離間して配置される。支持部材７に搭載された半導体ウエハ２は、支持部材７に対面している非スパッタ面２ｂを有する。搬送治具３は軟性部材８を有する。軟性部材８は、スパッタ処理中に支持部材７に搭載された半導体ウエハ２の非スパッタ面２ｂにスパッタ粒子による付着を防止するように配置される。【選択図】図１