MOLD CLAMPING DEVICE, INJECTION MOLDING MACHINE, AND MOLD CLAMPING METHOD

To suppress a decrease in mold clamping force.SOLUTION: A mold clamping device includes: a fixed die 21 to which a fixed mold 26 is attached; a movable die 22 to which a movable mold 27 is attached; a link housing 30 located on an opposite side of the movable die 22 to a side where the fixed die 21 is located; a mold opening/closing mechanism 40 that has a mold clamping motor 60 and opens and closes the movable mold 27 and the fixed mold 26 and clamps the molds; a tie bar 70 connected to the fixed die 21 and the link housing 30; a mold thickness adjustment mechanism 80 having a tie bar nut 81 screwed into a thread part 71 of the tie bar 70 and disposed on the link housing 30; and a control device 100 that controls the mold opening/closing mechanism 40 and the mold thickness adjustment mechanism 80. When performing mold clamping, the control device 100 causes the movable mold 27 to approach at a very slow speed just before the movable mold 27 and the fixed mold 26 come into contact, and when the movable mold 27 and the fixed mold 26 come into contact, the control device stops the mold clamping motor 60 for a predetermined period, and after the predetermined period has elapsed, increases the rotational speed of the mold clamping motor 60 to perform mold clamping.SELECTED DRAWING: Figure 2 【課題】型締力の低下を抑制すること。【解決手段】固定金型２６が取り付けられる固定ダイ２１と、移動金型２７が取り付けられる移動ダイ２２と、移動ダイ２２における固定ダイ２１が配置される側の反対側に配置されるリンクハウジング３０と、型締モータ６０を有して移動金型２７と固定金型２６との開閉と型締めを行う型開閉機構４０と、固定ダイ２１とリンクハウジング３０に連結されるタイバ７０と、タイバ７０のねじ部７１と螺合してリンクハウジング３０に配置されるタイバナット８１を有する型厚調整機構８０と、型開閉機構４０と型厚調整機構８０を制御する制御装置１００と、を備え、制御装置１００は型締めを行う際に、移動金型２７と固定金型２６とが接触する直前で移動金型２７を微速で接近させ、移動金型２７と固定金型２６とが接触したら型締モータ６０を所定期間停止し、所定期間の経過後に型締モータ６０の回転速度を増加させて型締めを行う。【選択図】図２