HEAD FOR EJECTING REACTIVE GAS FOR DEPOSITING FILM AND METHOD FOR MANUFACTURING THE SAME

To provide a head that can evenly eject a reactive gas for depositing a film in a film deposition apparatus, and to provide a method for manufacturing the same.SOLUTION: A method for manufacturing a head includes the steps of: diffusion joining a first plate and a second plate to each other; and for...

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Bibliographische Detailangaben
Hauptverfasser:	ARAKI YOSHIHITO, KANEDA NORIYOSHI
Format:	Patent
Sprache:	eng ; jpn
Schlagworte:	CHEMICAL SURFACE TREATMENT CHEMISTRY COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING MATERIAL WITH METALLIC MATERIAL COATING METALLIC MATERIAL DIFFUSION TREATMENT OF METALLIC MATERIAL INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL METALLURGY SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION
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Beschreibung
Zusammenfassung:	To provide a head that can evenly eject a reactive gas for depositing a film in a film deposition apparatus, and to provide a method for manufacturing the same.SOLUTION: A method for manufacturing a head includes the steps of: diffusion joining a first plate and a second plate to each other; and forming a nickel-containing film at surfaces of the first plate and the second plate with electroless plating after the diffusion joining. The first plate and the second plate are configured to have a flow channel so that a reactive gas passes through from the first plate to the second plate while the first plate and the second plate are joined.SELECTED DRAWING: Figure 5 【課題】成膜装置内で成膜用反応性ガスを均一に射出可能なヘッド、およびその製造方法を提供すること。【解決手段】ヘッドの製造方法は、第１のプレートと第２のプレートを互いに拡散接合すること、および、拡散接合の後、第１のプレートと第２のプレートの表面にニッケル含有膜を無電解めっきで形成することを含む。第１のプレートと第２のプレートは、接合された状態において、反応性ガスが第１のプレート側から第２のプレート側へ通過する流路を有するように構成される。【選択図】図５