SURFACE EMITTING DEVICE, DISPLAY DEVICE, METHOD FOR MANUFACTURING SURFACE EMITTING DEVICE AND ENCAPSULATING MATERIAL SHEET FOR SURFACE EMITTING DEVICE
To provide a surface emitting device with an improved yield by preventing warpage during manufacturing.SOLUTION: In a surface light emitting device 1 comprising a light emitting diode substrate 4 having a light emitting diode element 3 disposed on one side of a support substrate 2, a sealing member...
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| creator | KANAI YOSHIHIRO TSUZUKI ATSURO SAEKI KOSUKE OHASHI ERINA NISHIKAWA MARIE |
| description | To provide a surface emitting device with an improved yield by preventing warpage during manufacturing.SOLUTION: In a surface light emitting device 1 comprising a light emitting diode substrate 4 having a light emitting diode element 3 disposed on one side of a support substrate 2, a sealing member 5 encapsulating the light emitting diode element 3 of the light emitting diode substrate 4, an anti-warping layer 7 disposed on an opposite side of the sealing member 5 to the light emitting diode substrate 4, and a diffusion member 6 disposed on an opposite side of the anti-warping layer 7 to the light emitting diode substrate, the encapsulating member 5 has a haze value of 4% or more, a thickness of 50 μm or greater and 800 μm or less, and is composed of a polyolefin resin, and a linear expansion coefficient of a material configuring the anti-warping layer 7 is -15×10-6/°C to 10×10-6/°C, and the linear expansion coefficient of the support substrate 2 is 5×10-6/°C and 100×10-6/°C, and the anti-warping layer 7 and sealing member 5 are in close contact.SELECTED DRAWING: Figure 1
【課題】製造時の反りの発生を防止し、歩留まりが向上した面発光装置を提供する。【解決手段】支持基板２の片側の面側に配置された発光ダイオード素子３を有する発光ダイオード基板４と、発光ダイオード基板４の発光ダイオード素子３を封止する封止部材５と、封止部材５の発光ダイオード基板４とは反対側の面に配置された反り防止層７と、反り防止層７の発光ダイオード基板とは反対側の面に配置された拡散部材６と、を有する面発光装置１であって、封止部材５は、ヘイズ値が４％以上であり、厚みが、５０μｍ以上８００μｍ以下であり、ポリオレフィン系樹脂で構成され、反り防止層７を構成する材料の線膨張係数が、－１５×１０－６／℃以上１０×１０－６／℃以下の範囲内であり、支持基板２の線膨張係数は、５×１０－６／℃以上１００×１０－６／℃以下の範囲内であり、反り防止層７および封止部材５が密着している。【選択図】図１ |
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【課題】製造時の反りの発生を防止し、歩留まりが向上した面発光装置を提供する。【解決手段】支持基板２の片側の面側に配置された発光ダイオード素子３を有する発光ダイオード基板４と、発光ダイオード基板４の発光ダイオード素子３を封止する封止部材５と、封止部材５の発光ダイオード基板４とは反対側の面に配置された反り防止層７と、反り防止層７の発光ダイオード基板とは反対側の面に配置された拡散部材６と、を有する面発光装置１であって、封止部材５は、ヘイズ値が４％以上であり、厚みが、５０μｍ以上８００μｍ以下であり、ポリオレフィン系樹脂で構成され、反り防止層７を構成する材料の線膨張係数が、－１５×１０－６／℃以上１０×１０－６／℃以下の範囲内であり、支持基板２の線膨張係数は、５×１０－６／℃以上１００×１０－６／℃以下の範囲内であり、反り防止層７および封止部材５が密着している。【選択図】図１</description><language>eng ; jpn</language><subject>BASIC ELECTRIC ELEMENTS ; BLASTING ; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMSTHEREOF ; HEATING ; LIGHTING ; MECHANICAL ENGINEERING ; NON-PORTABLE LIGHTING DEVICES ; SEMICONDUCTOR DEVICES ; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHERARTICLES, NOT OTHERWISE PROVIDED FOR ; SYSTEMS THEREOF ; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLEEXTERIORS ; WEAPONS</subject><creationdate>2024</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20240214&DB=EPODOC&CC=JP&NR=2024020269A$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,776,881,25543,76294</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20240214&DB=EPODOC&CC=JP&NR=2024020269A$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>KANAI YOSHIHIRO</creatorcontrib><creatorcontrib>TSUZUKI ATSURO</creatorcontrib><creatorcontrib>SAEKI KOSUKE</creatorcontrib><creatorcontrib>OHASHI ERINA</creatorcontrib><creatorcontrib>NISHIKAWA MARIE</creatorcontrib><title>SURFACE EMITTING DEVICE, DISPLAY DEVICE, METHOD FOR MANUFACTURING SURFACE EMITTING DEVICE AND ENCAPSULATING MATERIAL SHEET FOR SURFACE EMITTING DEVICE</title><description>To provide a surface emitting device with an improved yield by preventing warpage during manufacturing.SOLUTION: In a surface light emitting device 1 comprising a light emitting diode substrate 4 having a light emitting diode element 3 disposed on one side of a support substrate 2, a sealing member 5 encapsulating the light emitting diode element 3 of the light emitting diode substrate 4, an anti-warping layer 7 disposed on an opposite side of the sealing member 5 to the light emitting diode substrate 4, and a diffusion member 6 disposed on an opposite side of the anti-warping layer 7 to the light emitting diode substrate, the encapsulating member 5 has a haze value of 4% or more, a thickness of 50 μm or greater and 800 μm or less, and is composed of a polyolefin resin, and a linear expansion coefficient of a material configuring the anti-warping layer 7 is -15×10-6/°C to 10×10-6/°C, and the linear expansion coefficient of the support substrate 2 is 5×10-6/°C and 100×10-6/°C, and the anti-warping layer 7 and sealing member 5 are in close contact.SELECTED DRAWING: Figure 1
【課題】製造時の反りの発生を防止し、歩留まりが向上した面発光装置を提供する。【解決手段】支持基板２の片側の面側に配置された発光ダイオード素子３を有する発光ダイオード基板４と、発光ダイオード基板４の発光ダイオード素子３を封止する封止部材５と、封止部材５の発光ダイオード基板４とは反対側の面に配置された反り防止層７と、反り防止層７の発光ダイオード基板とは反対側の面に配置された拡散部材６と、を有する面発光装置１であって、封止部材５は、ヘイズ値が４％以上であり、厚みが、５０μｍ以上８００μｍ以下であり、ポリオレフィン系樹脂で構成され、反り防止層７を構成する材料の線膨張係数が、－１５×１０－６／℃以上１０×１０－６／℃以下の範囲内であり、支持基板２の線膨張係数は、５×１０－６／℃以上１００×１０－６／℃以下の範囲内であり、反り防止層７および封止部材５が密着している。【選択図】図１</description><subject>BASIC ELECTRIC ELEMENTS</subject><subject>BLASTING</subject><subject>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMSTHEREOF</subject><subject>HEATING</subject><subject>LIGHTING</subject><subject>MECHANICAL ENGINEERING</subject><subject>NON-PORTABLE LIGHTING DEVICES</subject><subject>SEMICONDUCTOR DEVICES</subject><subject>STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHERARTICLES, NOT OTHERWISE PROVIDED FOR</subject><subject>SYSTEMS THEREOF</subject><subject>VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLEEXTERIORS</subject><subject>WEAPONS</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2024</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZJgWHBrk5ujsquDq6xkS4unnruDiGubp7Kqj4OIZHODjGAnn-7qGePi7KLj5Byn4OvqFAjWFhAaBNOAwQcHRz0XB1c_ZMSA41McRLOHrGOIa5OnooxDs4eoaAjYKh2YeBta0xJziVF4ozc2g5OYa4uyhm1qQH59aXJCYnJqXWhLvFWBkYGRiACTMLB2NiVIEADEoQl8</recordid><startdate>20240214</startdate><enddate>20240214</enddate><creator>KANAI YOSHIHIRO</creator><creator>TSUZUKI ATSURO</creator><creator>SAEKI KOSUKE</creator><creator>OHASHI ERINA</creator><creator>NISHIKAWA MARIE</creator><scope>EVB</scope></search><sort><creationdate>20240214</creationdate><title>SURFACE EMITTING DEVICE, DISPLAY DEVICE, METHOD FOR MANUFACTURING SURFACE EMITTING DEVICE AND ENCAPSULATING MATERIAL SHEET FOR SURFACE EMITTING DEVICE</title><author>KANAI YOSHIHIRO ; TSUZUKI ATSURO ; SAEKI KOSUKE ; OHASHI ERINA ; NISHIKAWA MARIE</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_JP2024020269A3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng ; jpn</language><creationdate>2024</creationdate><topic>BASIC ELECTRIC ELEMENTS</topic><topic>BLASTING</topic><topic>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMSTHEREOF</topic><topic>HEATING</topic><topic>LIGHTING</topic><topic>MECHANICAL ENGINEERING</topic><topic>NON-PORTABLE LIGHTING DEVICES</topic><topic>SEMICONDUCTOR DEVICES</topic><topic>STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHERARTICLES, NOT OTHERWISE PROVIDED FOR</topic><topic>SYSTEMS THEREOF</topic><topic>VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLEEXTERIORS</topic><topic>WEAPONS</topic><toplevel>online_resources</toplevel><creatorcontrib>KANAI YOSHIHIRO</creatorcontrib><creatorcontrib>TSUZUKI ATSURO</creatorcontrib><creatorcontrib>SAEKI KOSUKE</creatorcontrib><creatorcontrib>OHASHI ERINA</creatorcontrib><creatorcontrib>NISHIKAWA MARIE</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>KANAI YOSHIHIRO</au><au>TSUZUKI ATSURO</au><au>SAEKI KOSUKE</au><au>OHASHI ERINA</au><au>NISHIKAWA MARIE</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>SURFACE EMITTING DEVICE, DISPLAY DEVICE, METHOD FOR MANUFACTURING SURFACE EMITTING DEVICE AND ENCAPSULATING MATERIAL SHEET FOR SURFACE EMITTING DEVICE</title><date>2024-02-14</date><risdate>2024</risdate><abstract>To provide a surface emitting device with an improved yield by preventing warpage during manufacturing.SOLUTION: In a surface light emitting device 1 comprising a light emitting diode substrate 4 having a light emitting diode element 3 disposed on one side of a support substrate 2, a sealing member 5 encapsulating the light emitting diode element 3 of the light emitting diode substrate 4, an anti-warping layer 7 disposed on an opposite side of the sealing member 5 to the light emitting diode substrate 4, and a diffusion member 6 disposed on an opposite side of the anti-warping layer 7 to the light emitting diode substrate, the encapsulating member 5 has a haze value of 4% or more, a thickness of 50 μm or greater and 800 μm or less, and is composed of a polyolefin resin, and a linear expansion coefficient of a material configuring the anti-warping layer 7 is -15×10-6/°C to 10×10-6/°C, and the linear expansion coefficient of the support substrate 2 is 5×10-6/°C and 100×10-6/°C, and the anti-warping layer 7 and sealing member 5 are in close contact.SELECTED DRAWING: Figure 1
【課題】製造時の反りの発生を防止し、歩留まりが向上した面発光装置を提供する。【解決手段】支持基板２の片側の面側に配置された発光ダイオード素子３を有する発光ダイオード基板４と、発光ダイオード基板４の発光ダイオード素子３を封止する封止部材５と、封止部材５の発光ダイオード基板４とは反対側の面に配置された反り防止層７と、反り防止層７の発光ダイオード基板とは反対側の面に配置された拡散部材６と、を有する面発光装置１であって、封止部材５は、ヘイズ値が４％以上であり、厚みが、５０μｍ以上８００μｍ以下であり、ポリオレフィン系樹脂で構成され、反り防止層７を構成する材料の線膨張係数が、－１５×１０－６／℃以上１０×１０－６／℃以下の範囲内であり、支持基板２の線膨張係数は、５×１０－６／℃以上１００×１０－６／℃以下の範囲内であり、反り防止層７および封止部材５が密着している。【選択図】図１</abstract><oa>free_for_read</oa></addata></record> |
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| subjects | BASIC ELECTRIC ELEMENTS BLASTING ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMSTHEREOF HEATING LIGHTING MECHANICAL ENGINEERING NON-PORTABLE LIGHTING DEVICES SEMICONDUCTOR DEVICES STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHERARTICLES, NOT OTHERWISE PROVIDED FOR SYSTEMS THEREOF VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLEEXTERIORS WEAPONS |
| title | SURFACE EMITTING DEVICE, DISPLAY DEVICE, METHOD FOR MANUFACTURING SURFACE EMITTING DEVICE AND ENCAPSULATING MATERIAL SHEET FOR SURFACE EMITTING DEVICE |
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