SURFACE EMITTING DEVICE, DISPLAY DEVICE, METHOD FOR MANUFACTURING SURFACE EMITTING DEVICE AND ENCAPSULATING MATERIAL SHEET FOR SURFACE EMITTING DEVICE

To provide a surface emitting device with an improved yield by preventing warpage during manufacturing.SOLUTION: In a surface light emitting device 1 comprising a light emitting diode substrate 4 having a light emitting diode element 3 disposed on one side of a support substrate 2, a sealing member 5 encapsulating the light emitting diode element 3 of the light emitting diode substrate 4, an anti-warping layer 7 disposed on an opposite side of the sealing member 5 to the light emitting diode substrate 4, and a diffusion member 6 disposed on an opposite side of the anti-warping layer 7 to the light emitting diode substrate, the encapsulating member 5 has a haze value of 4% or more, a thickness of 50 μm or greater and 800 μm or less, and is composed of a polyolefin resin, and a linear expansion coefficient of a material configuring the anti-warping layer 7 is -15×10-6/°C to 10×10-6/°C, and the linear expansion coefficient of the support substrate 2 is 5×10-6/°C and 100×10-6/°C, and the anti-warping layer 7 and sealing member 5 are in close contact.SELECTED DRAWING: Figure 1 【課題】製造時の反りの発生を防止し、歩留まりが向上した面発光装置を提供する。【解決手段】支持基板２の片側の面側に配置された発光ダイオード素子３を有する発光ダイオード基板４と、発光ダイオード基板４の発光ダイオード素子３を封止する封止部材５と、封止部材５の発光ダイオード基板４とは反対側の面に配置された反り防止層７と、反り防止層７の発光ダイオード基板とは反対側の面に配置された拡散部材６と、を有する面発光装置１であって、封止部材５は、ヘイズ値が４％以上であり、厚みが、５０μｍ以上８００μｍ以下であり、ポリオレフィン系樹脂で構成され、反り防止層７を構成する材料の線膨張係数が、－１５×１０－６／℃以上１０×１０－６／℃以下の範囲内であり、支持基板２の線膨張係数は、５×１０－６／℃以上１００×１０－６／℃以下の範囲内であり、反り防止層７および封止部材５が密着している。【選択図】図１