ADHESIVE COMPOSITION, COVERLAY FILM COMPRISING THE SAME, AND PRINTED CIRCUIT BOARD

To provide an adhesive composition capable of forming an adhesive layer excellent in fluidity, filling (landfilling), anti-migration and the like, without degrading adhesiveness.SOLUTION: The adhesive composition includes: an epoxy resin; a binder resin containing at least one species of rubber; and...

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Bibliographische Detailangaben
Hauptverfasser:	JEONG INKI, KIM SUNGMOON, PARK SUBYUNG, PARK KWANGSEOK
Format:	Patent
Sprache:	eng ; jpn
Schlagworte:	ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE ADHESIVES CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS CHEMISTRY DYES ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS METALLURGY MISCELLANEOUS APPLICATIONS OF MATERIALS MISCELLANEOUS COMPOSITIONS NATURAL RESINS NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL PAINTS POLISHES PRINTED CIRCUITS USE OF MATERIALS AS ADHESIVES
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Beschreibung
Zusammenfassung:	To provide an adhesive composition capable of forming an adhesive layer excellent in fluidity, filling (landfilling), anti-migration and the like, without degrading adhesiveness.SOLUTION: The adhesive composition includes: an epoxy resin; a binder resin containing at least one species of rubber; and an inorganic filler. The adhesive composition has a viscosity of at most 8,000 cps.SELECTED DRAWING: Figure 1 【課題】本発明は、接着性が低下することなく、流れ性、充填性（埋め込み性）、耐マイグレーションなどに優れた接着層を形成することができる、接着組成物を提供することを目的とする。【解決手段】本発明の接着組成物は、エポキシ樹脂；１種以上のゴムを含有するバインダー樹脂；及び、無機フィラー；を含み、粘度が８，０００ｃｐｓ以下である。【選択図】図１