LAMINATED BAND-PASS FILTER

To obtain a laminated band-pass filter that makes it possible to mitigate the degradation of filter performance due to manufacturing dispersion.SOLUTION: A laminated band-pass filter 1 comprises: a dielectric substrate 2; and a laminate structure that includes a first grounding conductor that is pro...

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1. Verfasser: TSUNODA KOTA
Format: Patent
Sprache:eng ; jpn
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Zusammenfassung:To obtain a laminated band-pass filter that makes it possible to mitigate the degradation of filter performance due to manufacturing dispersion.SOLUTION: A laminated band-pass filter 1 comprises: a dielectric substrate 2; and a laminate structure that includes a first grounding conductor that is provided on a first side that is one end side of the dielectric substrate 2 in the thickness direction, a second grounding conductor that is provided on a second side that is the other end side of the dielectric substrate 2 in the thickness direction, and a conductive layer 3 that is an internal layer of the dielectric substrate 2 and has a plurality of resonators 8. The plurality of resonators 8 are such that one end of a resonator 8 is open, and the other end of the resonator 8 is electrically connected to the first and second grounding conductors, thereby constituting an inter-digital type filter. The conductive layer 3 is composed of a material the malleability of which is high, as compared with layers other than the conductive layer 3 of the laminate structure.SELECTED DRAWING: Figure 1 【課題】製造ばらつきによるフィルタ性能の劣化を低減可能とする積層バンドパスフィルタを得ること。【解決手段】積層バンドパスフィルタ1は、誘電体基板2と、誘電体基板2の厚さ方向における一方の端の面である第1面に設けられている第1の接地導体と、誘電体基板2の厚さ方向における他方の端の面である第2面に設けられている第2の接地導体と、誘電体基板2の内部の層であって、複数の共振器8を有する導電層3と、を含む積層構造を備える。複数の共振器8は、共振器8の一方の端部が開放されており、かつ共振器8の他方の端部が第1の接地導体および第2の接地導体に電気的に接続されており、インターディジタル型のフィルタを構成する。導電層3は、積層構造における導電層3以外の各層に比べて高い展性の材料からなる。【選択図】図1