SOLDER PASTE AND MOUNTING STRUCTURE
To provide a solder paste which contains phenol and an epoxy mixture, and exhibits excellent printing workability and excellent solder connection reliability, and a mounting structure using the same.SOLUTION: A solder paste contains solder powder and flux, wherein the flux contains an epoxy resin, a...
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| creator | HINO HIROHISA |
| description | To provide a solder paste which contains phenol and an epoxy mixture, and exhibits excellent printing workability and excellent solder connection reliability, and a mounting structure using the same.SOLUTION: A solder paste contains solder powder and flux, wherein the flux contains an epoxy resin, a phenol resin, an activator and an organic polymer fiber, the phenol resin contains one or more phenol resins having a phenolic hydroxyl group and an allyl group in the molecule, the average fiber diameter (D) of the organic polymer fiber is 1 μm to 5 μm, the average fiber length (L) of the organic polymer fiber is 10 μm to 30 μm, and an aspect ratio (L/D) of the organic polymer fiber is 2 to 30.SELECTED DRAWING: Figure 1
【課題】本発明は、フェノール＋エポキシ混合物を含み、優れた印刷作業性および優れたはんだ接続信頼性を示すはんだペーストおよびそれを用いた実装構造体を提供することができる。【解決手段】はんだ粉末とフラックスとを含むはんだペーストであって、前記フラックスは、エポキシ樹脂、フェノール樹脂、活性剤および有機ポリマー繊維を含み、前記フェノール樹脂は、分子内にフェノール性水酸基とアリル基とを有するフェノール樹脂を１種以上含み、前記有機ポリマー繊維の平均繊維径（Ｄ）は１μｍ～５μｍであり、前記有機ポリマー繊維の平均繊維長さ（Ｌ）は１０μｍ～３０μｍであり、前記有機ポリマー繊維のアスペクト比（Ｌ／Ｄ）は２～３０である、はんだペーストを提供する。【選択図】図１ |
| format | Patent |
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【課題】本発明は、フェノール＋エポキシ混合物を含み、優れた印刷作業性および優れたはんだ接続信頼性を示すはんだペーストおよびそれを用いた実装構造体を提供することができる。【解決手段】はんだ粉末とフラックスとを含むはんだペーストであって、前記フラックスは、エポキシ樹脂、フェノール樹脂、活性剤および有機ポリマー繊維を含み、前記フェノール樹脂は、分子内にフェノール性水酸基とアリル基とを有するフェノール樹脂を１種以上含み、前記有機ポリマー繊維の平均繊維径（Ｄ）は１μｍ～５μｍであり、前記有機ポリマー繊維の平均繊維長さ（Ｌ）は１０μｍ～３０μｍであり、前記有機ポリマー繊維のアスペクト比（Ｌ／Ｄ）は２～３０である、はんだペーストを提供する。【選択図】図１</description><language>eng ; jpn</language><subject>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ; CLADDING OR PLATING BY SOLDERING OR WELDING ; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING ; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; MACHINE TOOLS ; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS ; METAL-WORKING NOT OTHERWISE PROVIDED FOR ; PERFORMING OPERATIONS ; PRINTED CIRCUITS ; SOLDERING OR UNSOLDERING ; TRANSPORTING ; WELDING ; WORKING BY LASER BEAM</subject><creationdate>2024</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20240208&DB=EPODOC&CC=JP&NR=2024017848A$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,780,885,25564,76547</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20240208&DB=EPODOC&CC=JP&NR=2024017848A$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>HINO HIROHISA</creatorcontrib><title>SOLDER PASTE AND MOUNTING STRUCTURE</title><description>To provide a solder paste which contains phenol and an epoxy mixture, and exhibits excellent printing workability and excellent solder connection reliability, and a mounting structure using the same.SOLUTION: A solder paste contains solder powder and flux, wherein the flux contains an epoxy resin, a phenol resin, an activator and an organic polymer fiber, the phenol resin contains one or more phenol resins having a phenolic hydroxyl group and an allyl group in the molecule, the average fiber diameter (D) of the organic polymer fiber is 1 μm to 5 μm, the average fiber length (L) of the organic polymer fiber is 10 μm to 30 μm, and an aspect ratio (L/D) of the organic polymer fiber is 2 to 30.SELECTED DRAWING: Figure 1
【課題】本発明は、フェノール＋エポキシ混合物を含み、優れた印刷作業性および優れたはんだ接続信頼性を示すはんだペーストおよびそれを用いた実装構造体を提供することができる。【解決手段】はんだ粉末とフラックスとを含むはんだペーストであって、前記フラックスは、エポキシ樹脂、フェノール樹脂、活性剤および有機ポリマー繊維を含み、前記フェノール樹脂は、分子内にフェノール性水酸基とアリル基とを有するフェノール樹脂を１種以上含み、前記有機ポリマー繊維の平均繊維径（Ｄ）は１μｍ～５μｍであり、前記有機ポリマー繊維の平均繊維長さ（Ｌ）は１０μｍ～３０μｍであり、前記有機ポリマー繊維のアスペクト比（Ｌ／Ｄ）は２～３０である、はんだペーストを提供する。【選択図】図１</description><subject>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</subject><subject>CLADDING OR PLATING BY SOLDERING OR WELDING</subject><subject>CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING</subject><subject>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>MACHINE TOOLS</subject><subject>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</subject><subject>METAL-WORKING NOT OTHERWISE PROVIDED FOR</subject><subject>PERFORMING OPERATIONS</subject><subject>PRINTED CIRCUITS</subject><subject>SOLDERING OR UNSOLDERING</subject><subject>TRANSPORTING</subject><subject>WELDING</subject><subject>WORKING BY LASER BEAM</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2024</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZFAO9vdxcQ1SCHAMDnFVcPRzUfD1D_UL8fRzVwgOCQp1DgkNcuVhYE1LzClO5YXS3AxKbq4hzh66qQX58anFBYnJqXmpJfFeAUYGRiYGhuYWJhaOxkQpAgCwMiNh</recordid><startdate>20240208</startdate><enddate>20240208</enddate><creator>HINO HIROHISA</creator><scope>EVB</scope></search><sort><creationdate>20240208</creationdate><title>SOLDER PASTE AND MOUNTING STRUCTURE</title><author>HINO HIROHISA</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_JP2024017848A3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng ; jpn</language><creationdate>2024</creationdate><topic>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</topic><topic>CLADDING OR PLATING BY SOLDERING OR WELDING</topic><topic>CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING</topic><topic>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>MACHINE TOOLS</topic><topic>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</topic><topic>METAL-WORKING NOT OTHERWISE PROVIDED FOR</topic><topic>PERFORMING OPERATIONS</topic><topic>PRINTED CIRCUITS</topic><topic>SOLDERING OR UNSOLDERING</topic><topic>TRANSPORTING</topic><topic>WELDING</topic><topic>WORKING BY LASER BEAM</topic><toplevel>online_resources</toplevel><creatorcontrib>HINO HIROHISA</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>HINO HIROHISA</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>SOLDER PASTE AND MOUNTING STRUCTURE</title><date>2024-02-08</date><risdate>2024</risdate><abstract>To provide a solder paste which contains phenol and an epoxy mixture, and exhibits excellent printing workability and excellent solder connection reliability, and a mounting structure using the same.SOLUTION: A solder paste contains solder powder and flux, wherein the flux contains an epoxy resin, a phenol resin, an activator and an organic polymer fiber, the phenol resin contains one or more phenol resins having a phenolic hydroxyl group and an allyl group in the molecule, the average fiber diameter (D) of the organic polymer fiber is 1 μm to 5 μm, the average fiber length (L) of the organic polymer fiber is 10 μm to 30 μm, and an aspect ratio (L/D) of the organic polymer fiber is 2 to 30.SELECTED DRAWING: Figure 1
【課題】本発明は、フェノール＋エポキシ混合物を含み、優れた印刷作業性および優れたはんだ接続信頼性を示すはんだペーストおよびそれを用いた実装構造体を提供することができる。【解決手段】はんだ粉末とフラックスとを含むはんだペーストであって、前記フラックスは、エポキシ樹脂、フェノール樹脂、活性剤および有機ポリマー繊維を含み、前記フェノール樹脂は、分子内にフェノール性水酸基とアリル基とを有するフェノール樹脂を１種以上含み、前記有機ポリマー繊維の平均繊維径（Ｄ）は１μｍ～５μｍであり、前記有機ポリマー繊維の平均繊維長さ（Ｌ）は１０μｍ～３０μｍであり、前記有機ポリマー繊維のアスペクト比（Ｌ／Ｄ）は２～３０である、はんだペーストを提供する。【選択図】図１</abstract><oa>free_for_read</oa></addata></record> |
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| subjects | CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS CLADDING OR PLATING BY SOLDERING OR WELDING CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MACHINE TOOLS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS METAL-WORKING NOT OTHERWISE PROVIDED FOR PERFORMING OPERATIONS PRINTED CIRCUITS SOLDERING OR UNSOLDERING TRANSPORTING WELDING WORKING BY LASER BEAM |
| title | SOLDER PASTE AND MOUNTING STRUCTURE |
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