GRINDING DEVICE

To provide a grinding device that reduces exhaust volume of exhaust means for improved economy.SOLUTION: A grinding device includes: a chuck table 6; movement means 55 that moves a chuck table 6 to an attachment/detachment region A where a wafer W is attached and removed and a grinding region B where the wafer is ground; a grinding wheel 33 that is disposed in the grinding region B and that grinds the wafer W while supplying grinding water thereto; a processing chamber 80 that covers the grinding wheel 33 and the chuck table 6; and a suction duct 72 that draws in and exhausts mist M from the processing chamber 80. The chuck table 6 has a disk-like table body 63 having a holding plane 62 that holds the wafer W by suction, a rotor 56 that rotates the table body 63, and a turntable 5 that has an opening 5a that causes the holding plane 62 to be exposed and that encloses the table body 63. A fan 64 is disposed on an outer periphery of the table body 63 that generates a negative pressure for drawing in mist M from a gap between the opening 5a and the table body 63.SELECTED DRAWING: Figure 2 【課題】排気手段の排気量を低減して経済性に優れた研削装置を提供する。【解決手段】チャックテーブル６と、ウエーハＷを着脱する着脱領域Ａとウエーハを研削する研削領域Ｂとにチャックテーブル６を移動する移動手段５５と、研削領域Ｂに配設されウエーハＷに研削水を供給しながら研削する研削ホイール３３と、研削ホイール３３とチャックテーブル６とを覆う加工室８０と、加工室８０内のミストＭを吸引して排気する吸引ダクト７２を含み、チャックテーブル６は、ウエーハＷを吸引保持する保持面６２を有する円板状のテーブル本体６３と、テーブル本体６３を回転する回転体５６と、保持面６２を露出させテーブル本体６３を囲繞する開口部５ａを有するターンテーブル５と、を備え、テーブル本体６３の外周には、開口部５ａとテーブル本体６３との隙間からミストＭを吸引する負圧を生成するファン６４が配設されている。【選択図】図２