MOUNTING DEVICE AND SEMICONDUCTOR DEVICE MANUFACTURING METHOD
To provide a technique that can improve the accuracy of abnormality inspection on the side of a device.SOLUTION: A mounting device includes at least one pair of mirrors installed to face each other, an imaging device provided such that a die and a reflective surface of the mirror are located within...
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Zusammenfassung: | To provide a technique that can improve the accuracy of abnormality inspection on the side of a device.SOLUTION: A mounting device includes at least one pair of mirrors installed to face each other, an imaging device provided such that a die and a reflective surface of the mirror are located within a field of view, an illumination device that emits illumination light along an optical axis of the imaging device, and wraparound light prevention means that prevents light passing around the die from reaching the imaging device among the light reflected by one of the reflective surfaces of the pair of mirrors.SELECTED DRAWING: Figure 4
【課題】素子の側面における異常検査の精度を向上することが可能な技術を提供することにある。【解決手段】実装装置は、少なくとも一対が対向するように設置されるミラーと、ダイおよび前記ミラーの反射面が視野内に位置するように設けられる撮像装置と、前記撮像装置の光学軸に沿って照明光を照射する照明装置と、前記一対のミラーの一方の反射面で反射する光のうち、前記ダイの周りを通過する光が前記撮像装置に届かないようにする回り込み光抑止手段と、を備える。【選択図】図4 |
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