SEALING RESIN COMPOSITION, ELECTRONIC COMPONENT DEVICE AND METHOD FOR PRODUCING ELECTRONIC COMPONENT DEVICE

To provide a sealing resin composition that yields a cured product with low relative dielectric constants and dielectric loss tangents, an electronic component device that is sealed using the sealing composition, and a method for producing an electronic component device that includes a sealing proce...

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Bibliographische Detailangaben
Hauptverfasser:	TANAKA MIKA, SUKEGAWA YUTA, UCHIYAMA CHIKA, TAKEUCHI YUMA, SAITO TAKAHIRO
Format:	Patent
Sprache:	eng ; jpn
Schlagworte:	ADHESIVES BASIC ELECTRIC ELEMENTS CHEMISTRY COMPOSITIONS BASED THEREON COMPOSITIONS OF MACROMOLECULAR COMPOUNDS DYES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FORELSEWHERE METALLURGY MISCELLANEOUS APPLICATIONS OF MATERIALS MISCELLANEOUS COMPOSITIONS NATURAL RESINS ORGANIC MACROMOLECULAR COMPOUNDS PAINTS POLISHES SEMICONDUCTOR DEVICES THEIR PREPARATION OR CHEMICAL WORKING-UP USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS
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Beschreibung
Zusammenfassung:	To provide a sealing resin composition that yields a cured product with low relative dielectric constants and dielectric loss tangents, an electronic component device that is sealed using the sealing composition, and a method for producing an electronic component device that includes a sealing process using the sealing resin composition.SOLUTION: A sealing resin composition disclosed herein includes an epoxy resin, a curing agent, sol-gel silica, and inorganic filler other than the sol-gel silica.SELECTED DRAWING: None 【課題】硬化物の比誘電率及び誘電正接が低い封止用樹脂組成物、これを用いて封止された電子部品装置、及びこれを用いて封止することを含む電子部品装置の製造方法の提供。【解決手段】本開示の封止用樹脂組成物は、エポキシ樹脂と、硬化剤と、ゾルゲルシリカと、ゾルゲルシリカ以外の無機充填材を含む。【選択図】なし