INTEGRATED CIRCUIT SEMICONDUCTOR ELEMENT
To provide an integrated circuit semiconductor element that improves the short channel effect and current drive capability.SOLUTION: An integrated circuit semiconductor element includes a field insulating layer 114-1 embedded in a field trench located within a substrate at a distance from each other...
Gespeichert in:
Hauptverfasser: | , , , , , , |
---|---|
Format: | Patent |
Sprache: | eng ; jpn |
Schlagworte: | |
Online-Zugang: | Volltext bestellen |
Tags: |
Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
|
Zusammenfassung: | To provide an integrated circuit semiconductor element that improves the short channel effect and current drive capability.SOLUTION: An integrated circuit semiconductor element includes a field insulating layer 114-1 embedded in a field trench located within a substrate at a distance from each other, an active region 116 limited by the field insulating layer, and an active fin F2 located over the active region and protruding from the surface of the field insulating layer, and the field insulating layer includes a first subfield insulating layer 114A and a second subfield insulating layer 114B, and the surface 114AT1 (124T) of the first subfield insulating layer is located at a lower level than the surface 120T of the second subfield insulating layer.SELECTED DRAWING: Figure 7
【課題】短チャネル効果を改善させ、電流駆動能を向上させる集積回路半導体素子を提供する。【解決手段】集積回路半導体素子は、基板の内部に互いに離隔されて位置するフィールドトレンチに埋め込まれたフィールド絶縁層114-1と、フィールド絶縁層によって限定されたアクティブ領域116と、アクティブ領域上に位置し、フィールド絶縁層の表面から突出したアクティブフィンF2と、を含み、フィールド絶縁層は、第1サブフィールド絶縁層114A及び第2サブフィールド絶縁層114Bを含み、第1サブフィールド絶縁層の表面114AT1(124T)は、第2サブフィールド絶縁層の表面120Tより低いレベルに位置する。【選択図】図7 |
---|