PEELING AID TAPE AND SUBSTRATE MANUFACTURING METHOD
To provide a peeling aid tape and a substrate manufacturing method that can be applied accurately to various component supply tapes.SOLUTION: A peeling aid tape 40 is attached to a component supply tape 13, which has a base tape 13a having a housing portion 13c that accommodates a component D, and a...
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| creator | LI QIANGLI ISOHATA YOSHIO |
| description | To provide a peeling aid tape and a substrate manufacturing method that can be applied accurately to various component supply tapes.SOLUTION: A peeling aid tape 40 is attached to a component supply tape 13, which has a base tape 13a having a housing portion 13c that accommodates a component D, and a cover tape 13b that covers the housing portion 13c. The peeling aid tape 40 includes an adhesive portion 40a that sticks to the cover tape 13b, a non-adhesive portion 40b that precedes the tip 13e of the component supply tape with the adhesive portion 40a stuck to the cover tape 13b, and a mark (border 40c) that allows a user to distinguish between the adhesive portion 40a and the non-adhesive portion 40b.SELECTED DRAWING: Figure 5
【課題】多様な部品供給テープに正確に貼付することができる剥離補助テープおよび基板製造方法を提供する。【解決手段】剥離補助テープ４０は、部品Ｄを収容する収容部１３ｃを有するベーステープ１３ａと、収容部１３ｃを覆うカバーテープ１３ｂを有する部品供給テープ１３に貼付される。剥離補助テープ４０は、カバーテープ１３ｂに貼り付く粘着部４０ａと、粘着部４０ａがカバーテープ１３ｂに貼り付いた状態で部品供給テープの先端１３ｅよりも先行する非粘着部４０ｂと、粘着部４０ａと非粘着部４０ｂを識別可能なマーク（境界４０ｃ）を有する。【選択図】図５ |
| format | Patent |
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【課題】多様な部品供給テープに正確に貼付することができる剥離補助テープおよび基板製造方法を提供する。【解決手段】剥離補助テープ４０は、部品Ｄを収容する収容部１３ｃを有するベーステープ１３ａと、収容部１３ｃを覆うカバーテープ１３ｂを有する部品供給テープ１３に貼付される。剥離補助テープ４０は、カバーテープ１３ｂに貼り付く粘着部４０ａと、粘着部４０ａがカバーテープ１３ｂに貼り付いた状態で部品供給テープの先端１３ｅよりも先行する非粘着部４０ｂと、粘着部４０ａと非粘着部４０ｂを識別可能なマーク（境界４０ｃ）を有する。【選択図】図５</description><language>eng ; jpn</language><subject>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS ; PRINTED CIRCUITS</subject><creationdate>2024</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20240201&DB=EPODOC&CC=JP&NR=2024013249A$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,780,885,25563,76318</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20240201&DB=EPODOC&CC=JP&NR=2024013249A$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>LI QIANGLI</creatorcontrib><creatorcontrib>ISOHATA YOSHIO</creatorcontrib><title>PEELING AID TAPE AND SUBSTRATE MANUFACTURING METHOD</title><description>To provide a peeling aid tape and a substrate manufacturing method that can be applied accurately to various component supply tapes.SOLUTION: A peeling aid tape 40 is attached to a component supply tape 13, which has a base tape 13a having a housing portion 13c that accommodates a component D, and a cover tape 13b that covers the housing portion 13c. The peeling aid tape 40 includes an adhesive portion 40a that sticks to the cover tape 13b, a non-adhesive portion 40b that precedes the tip 13e of the component supply tape with the adhesive portion 40a stuck to the cover tape 13b, and a mark (border 40c) that allows a user to distinguish between the adhesive portion 40a and the non-adhesive portion 40b.SELECTED DRAWING: Figure 5
【課題】多様な部品供給テープに正確に貼付することができる剥離補助テープおよび基板製造方法を提供する。【解決手段】剥離補助テープ４０は、部品Ｄを収容する収容部１３ｃを有するベーステープ１３ａと、収容部１３ｃを覆うカバーテープ１３ｂを有する部品供給テープ１３に貼付される。剥離補助テープ４０は、カバーテープ１３ｂに貼り付く粘着部４０ａと、粘着部４０ａがカバーテープ１３ｂに貼り付いた状態で部品供給テープの先端１３ｅよりも先行する非粘着部４０ｂと、粘着部４０ａと非粘着部４０ｂを識別可能なマーク（境界４０ｃ）を有する。【選択図】図５</description><subject>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</subject><subject>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</subject><subject>PRINTED CIRCUITS</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2024</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZDAOcHX18fRzV3D0dFEIcQxwVXD0c1EIDnUKDglyDHFV8HX0C3VzdA4JDQIp8nUN8fB34WFgTUvMKU7lhdLcDEpuriHOHrqpBfnxqcUFicmpeakl8V4BRgZGJgaGxkYmlo7GRCkCANkPJ2U</recordid><startdate>20240201</startdate><enddate>20240201</enddate><creator>LI QIANGLI</creator><creator>ISOHATA YOSHIO</creator><scope>EVB</scope></search><sort><creationdate>20240201</creationdate><title>PEELING AID TAPE AND SUBSTRATE MANUFACTURING METHOD</title><author>LI QIANGLI ; ISOHATA YOSHIO</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_JP2024013249A3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng ; jpn</language><creationdate>2024</creationdate><topic>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</topic><topic>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</topic><topic>PRINTED CIRCUITS</topic><toplevel>online_resources</toplevel><creatorcontrib>LI QIANGLI</creatorcontrib><creatorcontrib>ISOHATA YOSHIO</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>LI QIANGLI</au><au>ISOHATA YOSHIO</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>PEELING AID TAPE AND SUBSTRATE MANUFACTURING METHOD</title><date>2024-02-01</date><risdate>2024</risdate><abstract>To provide a peeling aid tape and a substrate manufacturing method that can be applied accurately to various component supply tapes.SOLUTION: A peeling aid tape 40 is attached to a component supply tape 13, which has a base tape 13a having a housing portion 13c that accommodates a component D, and a cover tape 13b that covers the housing portion 13c. The peeling aid tape 40 includes an adhesive portion 40a that sticks to the cover tape 13b, a non-adhesive portion 40b that precedes the tip 13e of the component supply tape with the adhesive portion 40a stuck to the cover tape 13b, and a mark (border 40c) that allows a user to distinguish between the adhesive portion 40a and the non-adhesive portion 40b.SELECTED DRAWING: Figure 5
【課題】多様な部品供給テープに正確に貼付することができる剥離補助テープおよび基板製造方法を提供する。【解決手段】剥離補助テープ４０は、部品Ｄを収容する収容部１３ｃを有するベーステープ１３ａと、収容部１３ｃを覆うカバーテープ１３ｂを有する部品供給テープ１３に貼付される。剥離補助テープ４０は、カバーテープ１３ｂに貼り付く粘着部４０ａと、粘着部４０ａがカバーテープ１３ｂに貼り付いた状態で部品供給テープの先端１３ｅよりも先行する非粘着部４０ｂと、粘着部４０ａと非粘着部４０ｂを識別可能なマーク（境界４０ｃ）を有する。【選択図】図５</abstract><oa>free_for_read</oa></addata></record> |
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| subjects | CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS |
| title | PEELING AID TAPE AND SUBSTRATE MANUFACTURING METHOD |
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