PEELING AID TAPE AND SUBSTRATE MANUFACTURING METHOD
To provide a peeling aid tape and a substrate manufacturing method that can be applied accurately to various component supply tapes.SOLUTION: A peeling aid tape 40 is attached to a component supply tape 13, which has a base tape 13a having a housing portion 13c that accommodates a component D, and a...
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| Format: | Patent |
| Sprache: | eng ; jpn |
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| Zusammenfassung: | To provide a peeling aid tape and a substrate manufacturing method that can be applied accurately to various component supply tapes.SOLUTION: A peeling aid tape 40 is attached to a component supply tape 13, which has a base tape 13a having a housing portion 13c that accommodates a component D, and a cover tape 13b that covers the housing portion 13c. The peeling aid tape 40 includes an adhesive portion 40a that sticks to the cover tape 13b, a non-adhesive portion 40b that precedes the tip 13e of the component supply tape with the adhesive portion 40a stuck to the cover tape 13b, and a mark (border 40c) that allows a user to distinguish between the adhesive portion 40a and the non-adhesive portion 40b.SELECTED DRAWING: Figure 5
【課題】多様な部品供給テープに正確に貼付することができる剥離補助テープおよび基板製造方法を提供する。【解決手段】剥離補助テープ４０は、部品Ｄを収容する収容部１３ｃを有するベーステープ１３ａと、収容部１３ｃを覆うカバーテープ１３ｂを有する部品供給テープ１３に貼付される。剥離補助テープ４０は、カバーテープ１３ｂに貼り付く粘着部４０ａと、粘着部４０ａがカバーテープ１３ｂに貼り付いた状態で部品供給テープの先端１３ｅよりも先行する非粘着部４０ｂと、粘着部４０ａと非粘着部４０ｂを識別可能なマーク（境界４０ｃ）を有する。【選択図】図５ |
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