SURFACE LIGHT-EMITTING DEVICE AND DISPLAY DEVICE

To provide a surface light-emitting device having good light extraction efficiency even if an LED bare chip is used.SOLUTION: A surface light-emitting device includes: a light-emitting diode substrate including a support substrate and a light-emitting diode element arranged on a surface on one side...

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Bibliographische Detailangaben
Hauptverfasser: KANAI YOSHIHIRO, TSUZUKI ATSURO, SAEKI KOSUKE, NISHIKAWA MARIE, FURUYA SHUNSUKE
Format: Patent
Sprache:eng ; jpn
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Beschreibung
Zusammenfassung:To provide a surface light-emitting device having good light extraction efficiency even if an LED bare chip is used.SOLUTION: A surface light-emitting device includes: a light-emitting diode substrate including a support substrate and a light-emitting diode element arranged on a surface on one side of the support substrate; a sealing member arranged on a surface of the light-emitting diode substrate on a light-emitting diode element side and sealing the light-emitting diode element; and a diffusion member arranged on a surface of the sealing member on a side opposite to a light-emitting diode substrate side. The diffusion member has a microlens array, and the sealing member is in contact with a surface of a transparent base material on a side opposite to a surface where a light-emitting layer is formed and a side surface of the transparent base material. The seaming member has a haze value of 4% or more, and a thickness thicker than that of the light-emitting diode element. In addition, the sealing member comprises an olefin-based resin.SELECTED DRAWING: Figure 1 【課題】LEDベアチップを用いた場合でも、光の取り出し効率の良好な面発光装置を提供する。【解決手段】支持基板、および上記支持基板の片側の面側に配置された発光ダイオード素子を有する発光ダイオード基板と、上記発光ダイオード基板の上記発光ダイオード素子側の面に配置され、上記発光ダイオード素子を封止する封止部材と、上記封止部材の上記発光ダイオード基板側とは反対側の面に配置された拡散部材と、を有する面発光装置であって、上記拡散部材は、マイクロレンズアレイを有するものであり、上記封止部材は、上記透明基材の発光層が形成された面とは反対側の面、および側面に接しており、上記封止部材は、ヘイズ値が4%以上であり、厚みが上記発光ダイオード素子の厚みより厚く、さらに、上記封止部材は、オレフィン系樹脂で構成されている、面発光装置。【選択図】図1