POLYMER COMPOUNDS, RESIN COMPOSITIONS, RESIN FILMS, PREPREGS, LAMINATES, PRINTED WIRING BOARDS, AND SEMICONDUCTOR PACKAGES
To provide: polymer compounds excellent in solvent solubility, heat resistance, and a low dielectric constant; and resin compositions, resin films, prepregs, laminates, printed wiring boards, and semiconductor packages.SOLUTION: The polymer compounds comprise a repeating unit represented by the gene...
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| creator | TAKEKOSHI HARUKA TAKATO KOICHI GOTO YOSHIHIRO SAWADA HIDEYUKI DOMON DAISUKE NAKAJIMA HIROSHI |
| description | To provide: polymer compounds excellent in solvent solubility, heat resistance, and a low dielectric constant; and resin compositions, resin films, prepregs, laminates, printed wiring boards, and semiconductor packages.SOLUTION: The polymer compounds comprise a repeating unit represented by the general formula (1) in the figure. In the general formula (1), X is a divalent organic group, and the broken lines are bonds.)SELECTED DRAWING: Figure 1
【課題】低誘電率性、溶剤溶解性、及び耐熱性に優れる高分子化合物、樹脂組成物、樹脂フィルム、プリプレグ、積層板、プリント配線板、及び半導体パッケージを提供すること。【解決手段】下記一般式（１）で表される繰り返し単位を含む高分子化合物。（一般式（１）においてＸは２価の有機基である。破線は結合手である。）TIFF2024012085000075.tif50169【選択図】図１ |
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【課題】低誘電率性、溶剤溶解性、及び耐熱性に優れる高分子化合物、樹脂組成物、樹脂フィルム、プリプレグ、積層板、プリント配線板、及び半導体パッケージを提供すること。【解決手段】下記一般式（１）で表される繰り返し単位を含む高分子化合物。（一般式（１）においてＸは２価の有機基である。破線は結合手である。）TIFF2024012085000075.tif50169【選択図】図１</description><language>eng ; jpn</language><subject>AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F,C08G ; CHEMISTRY ; COMPOSITIONS BASED THEREON ; COMPOSITIONS OF MACROMOLECULAR COMPOUNDS ; GENERAL PROCESSES OF COMPOUNDING ; LAYERED PRODUCTS ; LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM ; MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVINGCARBON-TO-CARBON UNSATURATED BONDS ; METALLURGY ; ORGANIC MACROMOLECULAR COMPOUNDS ; PERFORMING OPERATIONS ; THEIR PREPARATION OR CHEMICAL WORKING-UP ; TRANSPORTING ; WORKING-UP</subject><creationdate>2024</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20240125&DB=EPODOC&CC=JP&NR=2024012085A$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,776,881,25542,76290</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20240125&DB=EPODOC&CC=JP&NR=2024012085A$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>TAKEKOSHI HARUKA</creatorcontrib><creatorcontrib>TAKATO KOICHI</creatorcontrib><creatorcontrib>GOTO YOSHIHIRO</creatorcontrib><creatorcontrib>SAWADA HIDEYUKI</creatorcontrib><creatorcontrib>DOMON DAISUKE</creatorcontrib><creatorcontrib>NAKAJIMA HIROSHI</creatorcontrib><title>POLYMER COMPOUNDS, RESIN COMPOSITIONS, RESIN FILMS, PREPREGS, LAMINATES, PRINTED WIRING BOARDS, AND SEMICONDUCTOR PACKAGES</title><description>To provide: polymer compounds excellent in solvent solubility, heat resistance, and a low dielectric constant; and resin compositions, resin films, prepregs, laminates, printed wiring boards, and semiconductor packages.SOLUTION: The polymer compounds comprise a repeating unit represented by the general formula (1) in the figure. In the general formula (1), X is a divalent organic group, and the broken lines are bonds.)SELECTED DRAWING: Figure 1
【課題】低誘電率性、溶剤溶解性、及び耐熱性に優れる高分子化合物、樹脂組成物、樹脂フィルム、プリプレグ、積層板、プリント配線板、及び半導体パッケージを提供すること。【解決手段】下記一般式（１）で表される繰り返し単位を含む高分子化合物。（一般式（１）においてＸは２価の有機基である。破線は結合手である。）TIFF2024012085000075.tif50169【選択図】図１</description><subject>AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F,C08G</subject><subject>CHEMISTRY</subject><subject>COMPOSITIONS BASED THEREON</subject><subject>COMPOSITIONS OF MACROMOLECULAR COMPOUNDS</subject><subject>GENERAL PROCESSES OF COMPOUNDING</subject><subject>LAYERED PRODUCTS</subject><subject>LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM</subject><subject>MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVINGCARBON-TO-CARBON UNSATURATED BONDS</subject><subject>METALLURGY</subject><subject>ORGANIC MACROMOLECULAR COMPOUNDS</subject><subject>PERFORMING OPERATIONS</subject><subject>THEIR PREPARATION OR CHEMICAL WORKING-UP</subject><subject>TRANSPORTING</subject><subject>WORKING-UP</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2024</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNqNjD8LwjAUxLs4iPodgrNCrRZcY_JanzYvIUkRp1IkTqKFOvnpjX9wFg7u7sdxw-RhdHVUYJnQyuiapJsxCw7pAxx61PRjBVYqFmMhqoyp4gqJe3hDJA-SHTCGkm00t68zTpI5UCg0yVp4bZnhYs9LcONkcG4vfZh8fZRMC_BiOw_drQl9157CNdybncnSbJUusnSd8-VfoyehlDsJ</recordid><startdate>20240125</startdate><enddate>20240125</enddate><creator>TAKEKOSHI HARUKA</creator><creator>TAKATO KOICHI</creator><creator>GOTO YOSHIHIRO</creator><creator>SAWADA HIDEYUKI</creator><creator>DOMON DAISUKE</creator><creator>NAKAJIMA HIROSHI</creator><scope>EVB</scope></search><sort><creationdate>20240125</creationdate><title>POLYMER COMPOUNDS, RESIN COMPOSITIONS, RESIN FILMS, PREPREGS, LAMINATES, PRINTED WIRING BOARDS, AND SEMICONDUCTOR PACKAGES</title><author>TAKEKOSHI HARUKA ; TAKATO KOICHI ; GOTO YOSHIHIRO ; SAWADA HIDEYUKI ; DOMON DAISUKE ; NAKAJIMA HIROSHI</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_JP2024012085A3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng ; jpn</language><creationdate>2024</creationdate><topic>AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F,C08G</topic><topic>CHEMISTRY</topic><topic>COMPOSITIONS BASED THEREON</topic><topic>COMPOSITIONS OF MACROMOLECULAR COMPOUNDS</topic><topic>GENERAL PROCESSES OF COMPOUNDING</topic><topic>LAYERED PRODUCTS</topic><topic>LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM</topic><topic>MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVINGCARBON-TO-CARBON UNSATURATED BONDS</topic><topic>METALLURGY</topic><topic>ORGANIC MACROMOLECULAR COMPOUNDS</topic><topic>PERFORMING OPERATIONS</topic><topic>THEIR PREPARATION OR CHEMICAL WORKING-UP</topic><topic>TRANSPORTING</topic><topic>WORKING-UP</topic><toplevel>online_resources</toplevel><creatorcontrib>TAKEKOSHI HARUKA</creatorcontrib><creatorcontrib>TAKATO KOICHI</creatorcontrib><creatorcontrib>GOTO YOSHIHIRO</creatorcontrib><creatorcontrib>SAWADA HIDEYUKI</creatorcontrib><creatorcontrib>DOMON DAISUKE</creatorcontrib><creatorcontrib>NAKAJIMA HIROSHI</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>TAKEKOSHI HARUKA</au><au>TAKATO KOICHI</au><au>GOTO YOSHIHIRO</au><au>SAWADA HIDEYUKI</au><au>DOMON DAISUKE</au><au>NAKAJIMA HIROSHI</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>POLYMER COMPOUNDS, RESIN COMPOSITIONS, RESIN FILMS, PREPREGS, LAMINATES, PRINTED WIRING BOARDS, AND SEMICONDUCTOR PACKAGES</title><date>2024-01-25</date><risdate>2024</risdate><abstract>To provide: polymer compounds excellent in solvent solubility, heat resistance, and a low dielectric constant; and resin compositions, resin films, prepregs, laminates, printed wiring boards, and semiconductor packages.SOLUTION: The polymer compounds comprise a repeating unit represented by the general formula (1) in the figure. In the general formula (1), X is a divalent organic group, and the broken lines are bonds.)SELECTED DRAWING: Figure 1
【課題】低誘電率性、溶剤溶解性、及び耐熱性に優れる高分子化合物、樹脂組成物、樹脂フィルム、プリプレグ、積層板、プリント配線板、及び半導体パッケージを提供すること。【解決手段】下記一般式（１）で表される繰り返し単位を含む高分子化合物。（一般式（１）においてＸは２価の有機基である。破線は結合手である。）TIFF2024012085000075.tif50169【選択図】図１</abstract><oa>free_for_read</oa></addata></record> |
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| subjects | AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F,C08G CHEMISTRY COMPOSITIONS BASED THEREON COMPOSITIONS OF MACROMOLECULAR COMPOUNDS GENERAL PROCESSES OF COMPOUNDING LAYERED PRODUCTS LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVINGCARBON-TO-CARBON UNSATURATED BONDS METALLURGY ORGANIC MACROMOLECULAR COMPOUNDS PERFORMING OPERATIONS THEIR PREPARATION OR CHEMICAL WORKING-UP TRANSPORTING WORKING-UP |
| title | POLYMER COMPOUNDS, RESIN COMPOSITIONS, RESIN FILMS, PREPREGS, LAMINATES, PRINTED WIRING BOARDS, AND SEMICONDUCTOR PACKAGES |
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