POLYMER COMPOUNDS, RESIN COMPOSITIONS, RESIN FILMS, PREPREGS, LAMINATES, PRINTED WIRING BOARDS, AND SEMICONDUCTOR PACKAGES

To provide: polymer compounds excellent in solvent solubility, heat resistance, and a low dielectric constant; and resin compositions, resin films, prepregs, laminates, printed wiring boards, and semiconductor packages.SOLUTION: The polymer compounds comprise a repeating unit represented by the gene...

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Hauptverfasser:	TAKEKOSHI HARUKA, TAKATO KOICHI, GOTO YOSHIHIRO, SAWADA HIDEYUKI, DOMON DAISUKE, NAKAJIMA HIROSHI
Format:	Patent
Sprache:	eng ; jpn
Schlagworte:	AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F,C08G CHEMISTRY COMPOSITIONS BASED THEREON COMPOSITIONS OF MACROMOLECULAR COMPOUNDS GENERAL PROCESSES OF COMPOUNDING LAYERED PRODUCTS LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVINGCARBON-TO-CARBON UNSATURATED BONDS METALLURGY ORGANIC MACROMOLECULAR COMPOUNDS PERFORMING OPERATIONS THEIR PREPARATION OR CHEMICAL WORKING-UP TRANSPORTING WORKING-UP
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Zusammenfassung:	To provide: polymer compounds excellent in solvent solubility, heat resistance, and a low dielectric constant; and resin compositions, resin films, prepregs, laminates, printed wiring boards, and semiconductor packages.SOLUTION: The polymer compounds comprise a repeating unit represented by the general formula (1) in the figure. In the general formula (1), X is a divalent organic group, and the broken lines are bonds.)SELECTED DRAWING: Figure 1 【課題】低誘電率性、溶剤溶解性、及び耐熱性に優れる高分子化合物、樹脂組成物、樹脂フィルム、プリプレグ、積層板、プリント配線板、及び半導体パッケージを提供すること。【解決手段】下記一般式（１）で表される繰り返し単位を含む高分子化合物。（一般式（１）においてＸは２価の有機基である。破線は結合手である。）TIFF2024012085000075.tif50169【選択図】図１