ELECTRONIC COMPONENT MANUFACTURING METHOD

To provide an electronic component manufacturing method with which it is possible to effectively remove burrs and foreign matters, etc. that remain on cut surfaces that occur when a mother block is cut into a plurality of individual chips, reduce duration of a cleaning process, and improve productivity.SOLUTION: An electronic component manufacturing method comprises: a step in which a mother block 10 is cut into a plurality of individual chips 20; a step in which the plurality of chips 20 is held to a holding adhesive sheet 30A; a step in which the holding adhesive sheet 30A, with the plurality of chips 20 held thereto, is provided in an accommodation container 140; and a step in which the accommodation container 140 is immersed in a cleaning tank 111 which is filled with cleaning liquid 113, and the plurality of chips 20 is cleaned with the cleaning liquid 113. In the step for cleaning the plurality of chips 20, vibration is added to the cleaning liquid 113, and the cleaning tank 111 is provided with a movement mechanism and a rotation mechanism. The movement mechanism linearly moves the accommodation container 140, and the rotation mechanism rotates the accommodation container 140.SELECTED DRAWING: Figure 8 【課題】マザーブロックを複数の個片化したチップに切断した際に生じた切断面に残るバリや異物等を効率的に除去し、洗浄工程時間の低減を可能とし、生産性を向上させることができる電子部品の製造方法を提供すること。【解決手段】電子部品の製造方法は、マザーブロック１０を切断し、複数のチップ２０に個片化する工程と、複数のチップ２０を保持用粘着シート３０Ａに保持させる工程と、複数のチップ２０が保持された保持用粘着シート３０Ａを収納容器１４０に備える工程と、収納容器１４０を、洗浄液１１３が充填された洗浄槽１１１に浸漬し、洗浄液１１３により複数のチップ２０を洗浄する工程と、を備える。複数のチップ２０を洗浄する工程では、洗浄液１１３に振動が付与され、洗浄槽１１１は移動機構及び回転機構を備える。移動機構は収納容器１４０を直線的に移動させ、回転機構は収納容器１４０を回転させる。【選択図】図８