Co-Cr-Pt-OXIDE BASED SPUTTERING TARGET
To provide a sputtering target capable of stabilizing a voltage in sputtering regardless of a method of changing a composition and a leakage magnetic flux density, and a manufacturing method of the same.SOLUTION: A Co-Cr-Pt-oxide based sputtering target includes Co of 50 at% or more, Cr of more than...
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Zusammenfassung: | To provide a sputtering target capable of stabilizing a voltage in sputtering regardless of a method of changing a composition and a leakage magnetic flux density, and a manufacturing method of the same.SOLUTION: A Co-Cr-Pt-oxide based sputtering target includes Co of 50 at% or more, Cr of more than 0 at% and 20 at% or less, Pt of more than 0 at% and 25 at% or less, and a rest of one or more types of an oxide and an inevitable impurity. The sputtering target includes (A) includes a composite phase in which a Co oxide and a Pt oxide are dispersed alternately, and (B) ten or more metal Cr phases with an equivalent circle diameter of more than 10 μm and 100 μm or less within an observation area of 1 mm×1 mm under SEM at a magnification ratio of 50 times.SELECTED DRAWING: Figure 2
【課題】組成及び漏洩磁束密度を変更する方策によらずに、スパッタリング時の電圧を安定させることができるスパッタリングターゲット及びその製造方法を提供する。【解決手段】Coを50at.%以上、Crを0at.%超過20at.%以下、Ptを0at.%超過25at.%以下含み、残余が1種以上の酸化物並びに不可避不純物からなるCo-Cr-Pt-酸化物系スパッタリングターゲットであって、(A)Co、Pt及び酸化物が相互に分散している複合相と(B)金属Cr相とを含み、観察倍率50倍のSEMによる1mm×1mmの観察視野内に円相当径10μm超過100μm以下の金属Cr相を10個以上含むことを特徴とするスパッタリングターゲット。【選択図】図2 |
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