FLIP CHIP BONDING STRUCTURE AND SUBSTRATE THEREOF
To provide a flip chip bonding structure and a substrate thereof.SOLUTION: A plurality of circuits, an identification circuit, and a dummy lead are installed on the first surface of a translucent carrier. A support layer is provided on the second surface of the translucent carrier. A plurality of bu...
Gespeichert in:
| Hauptverfasser: | , , , , |
|---|---|
| Format: | Patent |
| Sprache: | eng ; jpn |
| Schlagworte: | |
| Online-Zugang: | Volltext bestellen |
| Tags: |
Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
|
| Zusammenfassung: | To provide a flip chip bonding structure and a substrate thereof.SOLUTION: A plurality of circuits, an identification circuit, and a dummy lead are installed on the first surface of a translucent carrier. A support layer is provided on the second surface of the translucent carrier. A plurality of bumps and an identification bump of the chip are respectively bonded to the plurality of circuits and the identification circuit. The bonding status of the circuit and the bump are determined by measuring the shadow through the opening in which the dummy lead, the identification circuit, and the shadow in which the identification bump is projected onto the second surface are exposed through the opening in the support layer.SELECTED DRAWING: Figure 4
【課題】フリップチップボンディング構造及びその基板を提供する。【解決手段】透光性キャリアの第１面には複数の回路、識別回路、及びダミーリードが設置される。透光性キャリアの第２面には支持層が設置される。チップの複数のバンプ及び識別バンプは複数の回路及び識別回路にそれぞれ接合される。支持層の開口部からはダミーリード、識別回路及び識別バンプが第２面に投影されるシャドウが露出される、開口部によりシャドウを測定することで、回路及びバンプの接合状態を判断する。【選択図】図４ |
|---|