SILVER ELECTRICAL PLATING COMPOSITION AND METHOD FOR ELECTRIC PLATING OF ROUGH SURFACE DULL SILVER

To provide a silver electrical plating composition and a method for electrical plating of rough surface dull silver.SOLUTION: A silver electrical plating composition makes coarse dull silver with a needle-like particle structure deposited. The deposition of the coarse dull silver enables good adhesi...

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Bibliographische Detailangaben
Hauptverfasser:	TING FAI LUNG, WU WEIGANG
Format:	Patent
Sprache:	eng ; jpn
Schlagworte:	APPARATUS THEREFOR CHEMISTRY ELECTROFORMING ELECTROLYTIC OR ELECTROPHORETIC PROCESSES METALLURGY PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTIONOF COATINGS
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Beschreibung
Zusammenfassung:	To provide a silver electrical plating composition and a method for electrical plating of rough surface dull silver.SOLUTION: A silver electrical plating composition makes coarse dull silver with a needle-like particle structure deposited. The deposition of the coarse dull silver enables good adhesion to dielectric materials even in environments with high relative humidity.SELECTED DRAWING: Figure 1 【課題】銀電気めっき組成物及び粗面無光沢銀を電気めっきするための方法を提供する。【解決手段】銀電気めっき組成物は、針状の粒子構造を有する粗い無光沢の銀を堆積させる。粗い無光沢の銀の堆積により、相対湿度が高い環境であっても誘電体材料との良好な接着が可能になる。【選択図】図１