PIEZOELECTRIC ELEMENT UNIT AND RESONATOR
To provide a piezoelectric element unit suitable for miniaturization and high packaging density, and provide a resonator including the piezoelectric element unit.SOLUTION: A piezoelectric element unit 100 includes a substrate 101 having a main surface 101A, a piezoelectric film 103 disposed on the s...
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| creator | SHIMOJI NORIYUKI |
| description | To provide a piezoelectric element unit suitable for miniaturization and high packaging density, and provide a resonator including the piezoelectric element unit.SOLUTION: A piezoelectric element unit 100 includes a substrate 101 having a main surface 101A, a piezoelectric film 103 disposed on the substrate 101 and having a side surface 103A, a side surface 103B opposite to the side surface 103A, and a bottom surface 103C facing the main surface 101A and connected to the side surface 103A and the side surface 103B, an electrode 104a disposed on the substrate 101 and in contact with the side surface 103A of the piezoelectric film 103, and an electrode 104b disposed on the substrate 101, in contact with at least one of the side surfaces 103A and 103B of the piezoelectric film 103, and separated from the electrode 104a.SELECTED DRAWING: Figure 1B
【課題】小型化及び高実装密度化に適した圧電素子ユニットを提供する。また、当該圧電素子ユニットを備えた共振器を提供する。【解決手段】主面１０１Ａを有する基板１０１と、基板１０１上に配置され、かつ、側面１０３Ａ、側面１０３Ａと反対側の側面１０３Ｂ、及び主面１０１Ａと対向し、側面１０３Ａ及び側面１０３Ｂと接続している底面１０３Ｃを有する圧電膜１０３と、基板１０１上に配置され、かつ、圧電膜１０３の側面１０３Ａと接している電極１０４ａと、基板１０１上に配置され、圧電膜１０３の側面１０３Ａ及び側面１０３Ｂの少なくともいずれかと接し、かつ、電極１０４ａと離隔している電極１０４ｂと、を備える圧電素子ユニット１００。【選択図】図１Ｂ |
| format | Patent |
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【課題】小型化及び高実装密度化に適した圧電素子ユニットを提供する。また、当該圧電素子ユニットを備えた共振器を提供する。【解決手段】主面１０１Ａを有する基板１０１と、基板１０１上に配置され、かつ、側面１０３Ａ、側面１０３Ａと反対側の側面１０３Ｂ、及び主面１０１Ａと対向し、側面１０３Ａ及び側面１０３Ｂと接続している底面１０３Ｃを有する圧電膜１０３と、基板１０１上に配置され、かつ、圧電膜１０３の側面１０３Ａと接している電極１０４ａと、基板１０１上に配置され、圧電膜１０３の側面１０３Ａ及び側面１０３Ｂの少なくともいずれかと接し、かつ、電極１０４ａと離隔している電極１０４ｂと、を備える圧電素子ユニット１００。【選択図】図１Ｂ</description><language>eng ; jpn</language><subject>BASIC ELECTRONIC CIRCUITRY ; ELECTRICITY ; IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS ; MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICALDEVICES ; MICROSTRUCTURAL TECHNOLOGY ; PERFORMING OPERATIONS ; RESONATORS ; TRANSPORTING</subject><creationdate>2024</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20240117&DB=EPODOC&CC=JP&NR=2024006648A$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,780,885,25564,76547</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20240117&DB=EPODOC&CC=JP&NR=2024006648A$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>SHIMOJI NORIYUKI</creatorcontrib><title>PIEZOELECTRIC ELEMENT UNIT AND RESONATOR</title><description>To provide a piezoelectric element unit suitable for miniaturization and high packaging density, and provide a resonator including the piezoelectric element unit.SOLUTION: A piezoelectric element unit 100 includes a substrate 101 having a main surface 101A, a piezoelectric film 103 disposed on the substrate 101 and having a side surface 103A, a side surface 103B opposite to the side surface 103A, and a bottom surface 103C facing the main surface 101A and connected to the side surface 103A and the side surface 103B, an electrode 104a disposed on the substrate 101 and in contact with the side surface 103A of the piezoelectric film 103, and an electrode 104b disposed on the substrate 101, in contact with at least one of the side surfaces 103A and 103B of the piezoelectric film 103, and separated from the electrode 104a.SELECTED DRAWING: Figure 1B
【課題】小型化及び高実装密度化に適した圧電素子ユニットを提供する。また、当該圧電素子ユニットを備えた共振器を提供する。【解決手段】主面１０１Ａを有する基板１０１と、基板１０１上に配置され、かつ、側面１０３Ａ、側面１０３Ａと反対側の側面１０３Ｂ、及び主面１０１Ａと対向し、側面１０３Ａ及び側面１０３Ｂと接続している底面１０３Ｃを有する圧電膜１０３と、基板１０１上に配置され、かつ、圧電膜１０３の側面１０３Ａと接している電極１０４ａと、基板１０１上に配置され、圧電膜１０３の側面１０３Ａ及び側面１０３Ｂの少なくともいずれかと接し、かつ、電極１０４ａと離隔している電極１０４ｂと、を備える圧電素子ユニット１００。【選択図】図１Ｂ</description><subject>BASIC ELECTRONIC CIRCUITRY</subject><subject>ELECTRICITY</subject><subject>IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS</subject><subject>MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICALDEVICES</subject><subject>MICROSTRUCTURAL TECHNOLOGY</subject><subject>PERFORMING OPERATIONS</subject><subject>RESONATORS</subject><subject>TRANSPORTING</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2024</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZNAI8HSN8nf1cXUOCfJ0VgAyfF39QhRC_TxDFBz9XBSCXIP9_RxD_IN4GFjTEnOKU3mhNDeDkptriLOHbmpBfnxqcUFicmpeakm8V4CRgZGJgYGZmYmFozFRigBhFCSv</recordid><startdate>20240117</startdate><enddate>20240117</enddate><creator>SHIMOJI NORIYUKI</creator><scope>EVB</scope></search><sort><creationdate>20240117</creationdate><title>PIEZOELECTRIC ELEMENT UNIT AND RESONATOR</title><author>SHIMOJI NORIYUKI</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_JP2024006648A3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng ; jpn</language><creationdate>2024</creationdate><topic>BASIC ELECTRONIC CIRCUITRY</topic><topic>ELECTRICITY</topic><topic>IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS</topic><topic>MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICALDEVICES</topic><topic>MICROSTRUCTURAL TECHNOLOGY</topic><topic>PERFORMING OPERATIONS</topic><topic>RESONATORS</topic><topic>TRANSPORTING</topic><toplevel>online_resources</toplevel><creatorcontrib>SHIMOJI NORIYUKI</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>SHIMOJI NORIYUKI</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>PIEZOELECTRIC ELEMENT UNIT AND RESONATOR</title><date>2024-01-17</date><risdate>2024</risdate><abstract>To provide a piezoelectric element unit suitable for miniaturization and high packaging density, and provide a resonator including the piezoelectric element unit.SOLUTION: A piezoelectric element unit 100 includes a substrate 101 having a main surface 101A, a piezoelectric film 103 disposed on the substrate 101 and having a side surface 103A, a side surface 103B opposite to the side surface 103A, and a bottom surface 103C facing the main surface 101A and connected to the side surface 103A and the side surface 103B, an electrode 104a disposed on the substrate 101 and in contact with the side surface 103A of the piezoelectric film 103, and an electrode 104b disposed on the substrate 101, in contact with at least one of the side surfaces 103A and 103B of the piezoelectric film 103, and separated from the electrode 104a.SELECTED DRAWING: Figure 1B
【課題】小型化及び高実装密度化に適した圧電素子ユニットを提供する。また、当該圧電素子ユニットを備えた共振器を提供する。【解決手段】主面１０１Ａを有する基板１０１と、基板１０１上に配置され、かつ、側面１０３Ａ、側面１０３Ａと反対側の側面１０３Ｂ、及び主面１０１Ａと対向し、側面１０３Ａ及び側面１０３Ｂと接続している底面１０３Ｃを有する圧電膜１０３と、基板１０１上に配置され、かつ、圧電膜１０３の側面１０３Ａと接している電極１０４ａと、基板１０１上に配置され、圧電膜１０３の側面１０３Ａ及び側面１０３Ｂの少なくともいずれかと接し、かつ、電極１０４ａと離隔している電極１０４ｂと、を備える圧電素子ユニット１００。【選択図】図１Ｂ</abstract><oa>free_for_read</oa></addata></record> |
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| subjects | BASIC ELECTRONIC CIRCUITRY ELECTRICITY IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICALDEVICES MICROSTRUCTURAL TECHNOLOGY PERFORMING OPERATIONS RESONATORS TRANSPORTING |
| title | PIEZOELECTRIC ELEMENT UNIT AND RESONATOR |
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