WIRING BOARD AND METHOD FOR MANUFACTURING THE SAME, IDENTIFICATION METHOD FOR WIRING BOARD

To provide compact wiring boards with identification information.SOLUTION: The wiring board is a wiring board consisting of an insulating layer, a dispersion layer, and a wiring layer, and the dispersion layer has a unique dispersion pattern of filler dispersed in the main material, and the dispersi...

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Bibliographische Detailangaben
1. Verfasser:	WADA KAZUTERU
Format:	Patent
Sprache:	eng ; jpn
Schlagworte:	CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS
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Beschreibung
Zusammenfassung:	To provide compact wiring boards with identification information.SOLUTION: The wiring board is a wiring board consisting of an insulating layer, a dispersion layer, and a wiring layer, and the dispersion layer has a unique dispersion pattern of filler dispersed in the main material, and the dispersion pattern is image recognizable from outside the wiring board.SELECTED DRAWING: Figure 2 【課題】識別情報を備えた小型の配線基板を提供する。【解決手段】本配線基板は、絶縁層と分散層と配線層が積層された配線基板であって、前記分散層は、主材料に充填材を分散させた固有の分散パターンを備え、前記分散パターンは、前記配線基板の外側から画像認識が可能である。【選択図】図２