ELASTIC WAVE DEVICE

To provide an elastic wave device which can be reasonably miniaturized without reducing the shear strength of a device chip against a package substrate.SOLUTION: Provided is an elastic wave device in which a package substrate 2 and a device chip 3 that is mounted on the package substrate 2 such that a main surface 3a having a functional element including an IDT electrode 7 faces one side 2a of the package substrate 2 are fastened by a main fastening part 11 which comprises a bump 4 that electrically connects a circuit on a side of the device chip 3 including the functional element and a circuit on a side of the package substrate 2, and an adhesive layer 10 that is interposed between the one side 2a of the package substrate 2 and the main surface 3a of the device chip 3 in the vicinity of the bump 4.SELECTED DRAWING: Figure 1 【課題】弾性波デバイスにおいて、デバイスチップのパッケージ基板に対するシェア強度を低下させることなく、バンプを合理的に小型化できるようにする。【解決手段】パッケージ基板２の一面２ａにＩＤＴ電極７を含む機能素子を有する主面３ａを向き合わせて前記パッケージ基板２に実装されるデバイスチップ３と前記パッケージ基板２とを、前記機能素子を含む前記デバイスチップ３側の回路と前記パッケージ基板２側の回路とを電気的に接続させるバンプ４と、このバンプ４の近傍にあって前記パッケージ基板２の前記一面２ａと前記デバイスチップ３の前記主面３ａとの間に介在される接着層１０とからなる主固着部１１によって固着させてなる。【選択図】図１