METHOD OF MANUFACTURING WAFER

To provide a method of manufacturing a wafer that can improve the throughput while reducing a waste of material.SOLUTION: A method of manufacturing a wafer includes: an entire plane processing step 1 of forming a separation initiating point in entire planes in an ingot by repeating a separation init...

Ausführliche Beschreibung

Bibliographische Detailangaben

1. Verfasser:	IGA YUTO
Format:	Patent
Sprache:	eng ; jpn
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
Online-Zugang:	Volltext bestellen
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