COOLING MODULE AND ELECTRONIC EQUIPMENT

To improve cooling performance by reducing the ventilation resistance of a heat sink while ensuring heat transfer efficiency from a heat pipe to the fins.SOLUTION: A cooling module includes a fan, a heat sink, and a first heat pipe and a second heat pipe that are connected to a first surface of the...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	HASHIBA JUNKI, KITAMURA MASAHIRO, TOMIZAWA SHUSAKU
Format:	Patent
Sprache:	eng ; jpn
Schlagworte:	BASIC ELECTRIC ELEMENTS CALCULATING CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS COMPUTING COUNTING ELECTRIC DIGITAL DATA PROCESSING ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PHYSICS PRINTED CIRCUITS SEMICONDUCTOR DEVICES
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