COOLING MODULE AND ELECTRONIC EQUIPMENT

To improve cooling performance by reducing the ventilation resistance of a heat sink while ensuring heat transfer efficiency from a heat pipe to the fins.SOLUTION: A cooling module includes a fan, a heat sink, and a first heat pipe and a second heat pipe that are connected to a first surface of the heat sink and arranged along an air flowing direction in the heat sink which directs from an air introduction surface to an air discharge surface. The heat sink includes a valley portion in which the second surface is recessed toward the first surface side, a first ridge portion which is provided between the valley portion and the air introduction surface and in which the fins are higher than the valley portion, and a second ridge portion which is provided between the valley portion and the air discharge surface and in which the fins are higher than the valley portion. When viewed in the stacking direction of the heat sink, the first heat pipe, and the second heat pipe, the first ridge portion is located at a position where it overlaps the first heat pipe, and the second ridge portion is located at a position where it overlaps the second heat pipe.SELECTED DRAWING: Figure 4 【課題】ヒートパイプからフィンへの熱伝達効率を確保しつつ、ヒートシンクの通風抵抗を低減して冷却性能を向上させる。【解決手段】冷却モジュールは、ファンと、ヒートシンクと、ヒートシンクの第１面に接続され、空気導入面から空気排出面に向かうヒートシンクでの空気の流通方向に沿って並んだ第１ヒートパイプ及び第２ヒートパイプと、を備える。ヒートシンクは、第２面を第１面側に向かって凹ませた谷部と、谷部と空気導入面との間に設けられ、谷部よりもフィンの高さが高い第１山部と、谷部と空気排出面との間に設けられ、谷部よりもフィンの高さが高い第２山部と、を有する。前記ヒートシンクと前記第１ヒートパイプ及び前記第２ヒートパイプの積層方向で見て、第１山部が第１ヒートパイプとオーバーラップした位置にあり、第２山部が第２ヒートパイプとオーバーラップした位置にある。【選択図】図４