SOLID-STATE IMAGING DEVICE, METHOD FOR PRODUCING SOLID-STATE IMAGING DEVICE, AND ELECTRONIC DEVICE
To provide a solid-state imaging device capable of further improving reliability of the solid-state imaging device and further reducing manufacturing cost.SOLUTION: Provide is a solid-state imaging device in which a second semiconductor substrate provided with a photoelectric conversion unit and a s...
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| creator | HIRAMATSU KATSUNORI |
| description | To provide a solid-state imaging device capable of further improving reliability of the solid-state imaging device and further reducing manufacturing cost.SOLUTION: Provide is a solid-state imaging device in which a second semiconductor substrate provided with a photoelectric conversion unit and a second element, a second insulating layer, a first semiconductor substrate provided with a first element, and a first insulating layer are arranged in this order from a light incident side, and which has a groove-like part formed on the first semiconductor substrate. The groove-like part has a first side wall and a second side wall, and a part of at least one side wall of the first side wall and the second side wall extends in an oblique direction with respect to a surface of the first semiconductor substrate on the light incident side.SELECTED DRAWING: Figure 3
【課題】固体撮像装置の更なる信頼性の向上や製造コストの更なる抑制を実現することができる固体撮像装置を提供すること。【解決手段】光入射側から順に、光電変換部と第２素子とが設けられた第２半導体基板と、第２絶縁層と、第１素子が設けられた第１半導体基板と、第１絶縁層とが配され、該第１半導体基板に形成された溝状部を有し、該溝状部が第１側壁と第２側壁とを有し、該第１側壁及び該第２側壁のうち少なくとも一方の側壁の一部が、該第１半導体基板の該光入射側の面に対して斜め方向に延在する、固体撮像装置を提供する。【選択図】図３ |
| format | Patent |
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【課題】固体撮像装置の更なる信頼性の向上や製造コストの更なる抑制を実現することができる固体撮像装置を提供すること。【解決手段】光入射側から順に、光電変換部と第２素子とが設けられた第２半導体基板と、第２絶縁層と、第１素子が設けられた第１半導体基板と、第１絶縁層とが配され、該第１半導体基板に形成された溝状部を有し、該溝状部が第１側壁と第２側壁とを有し、該第１側壁及び該第２側壁のうち少なくとも一方の側壁の一部が、該第１半導体基板の該光入射側の面に対して斜め方向に延在する、固体撮像装置を提供する。【選択図】図３</description><language>eng ; jpn</language><subject>BASIC ELECTRIC ELEMENTS ; ELECTRIC COMMUNICATION TECHNIQUE ; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; PICTORIAL COMMUNICATION, e.g. TELEVISION ; SEMICONDUCTOR DEVICES</subject><creationdate>2023</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20231221&DB=EPODOC&CC=JP&NR=2023181289A$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,776,881,25542,76290</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20231221&DB=EPODOC&CC=JP&NR=2023181289A$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>HIRAMATSU KATSUNORI</creatorcontrib><title>SOLID-STATE IMAGING DEVICE, METHOD FOR PRODUCING SOLID-STATE IMAGING DEVICE, AND ELECTRONIC DEVICE</title><description>To provide a solid-state imaging device capable of further improving reliability of the solid-state imaging device and further reducing manufacturing cost.SOLUTION: Provide is a solid-state imaging device in which a second semiconductor substrate provided with a photoelectric conversion unit and a second element, a second insulating layer, a first semiconductor substrate provided with a first element, and a first insulating layer are arranged in this order from a light incident side, and which has a groove-like part formed on the first semiconductor substrate. The groove-like part has a first side wall and a second side wall, and a part of at least one side wall of the first side wall and the second side wall extends in an oblique direction with respect to a surface of the first semiconductor substrate on the light incident side.SELECTED DRAWING: Figure 3
【課題】固体撮像装置の更なる信頼性の向上や製造コストの更なる抑制を実現することができる固体撮像装置を提供すること。【解決手段】光入射側から順に、光電変換部と第２素子とが設けられた第２半導体基板と、第２絶縁層と、第１素子が設けられた第１半導体基板と、第１絶縁層とが配され、該第１半導体基板に形成された溝状部を有し、該溝状部が第１側壁と第２側壁とを有し、該第１側壁及び該第２側壁のうち少なくとも一方の側壁の一部が、該第１半導体基板の該光入射側の面に対して斜め方向に延在する、固体撮像装置を提供する。【選択図】図３</description><subject>BASIC ELECTRIC ELEMENTS</subject><subject>ELECTRIC COMMUNICATION TECHNIQUE</subject><subject>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>PICTORIAL COMMUNICATION, e.g. TELEVISION</subject><subject>SEMICONDUCTOR DEVICES</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2023</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZEgK9vfxdNENDnEMcVXw9HV09_RzV3BxDfN0dtVR8HUN8fB3UXDzD1IICPJ3CXUGSeLT4OjnouDq4-ocEuTv5-kMFeZhYE1LzClO5YXS3AxKbq4hzh66qQX58anFBYnJqXmpJfFeAUYGRsaGFoZGFpaOxkQpAgAIRzPl</recordid><startdate>20231221</startdate><enddate>20231221</enddate><creator>HIRAMATSU KATSUNORI</creator><scope>EVB</scope></search><sort><creationdate>20231221</creationdate><title>SOLID-STATE IMAGING DEVICE, METHOD FOR PRODUCING SOLID-STATE IMAGING DEVICE, AND ELECTRONIC DEVICE</title><author>HIRAMATSU KATSUNORI</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_JP2023181289A3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng ; jpn</language><creationdate>2023</creationdate><topic>BASIC ELECTRIC ELEMENTS</topic><topic>ELECTRIC COMMUNICATION TECHNIQUE</topic><topic>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>PICTORIAL COMMUNICATION, e.g. TELEVISION</topic><topic>SEMICONDUCTOR DEVICES</topic><toplevel>online_resources</toplevel><creatorcontrib>HIRAMATSU KATSUNORI</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>HIRAMATSU KATSUNORI</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>SOLID-STATE IMAGING DEVICE, METHOD FOR PRODUCING SOLID-STATE IMAGING DEVICE, AND ELECTRONIC DEVICE</title><date>2023-12-21</date><risdate>2023</risdate><abstract>To provide a solid-state imaging device capable of further improving reliability of the solid-state imaging device and further reducing manufacturing cost.SOLUTION: Provide is a solid-state imaging device in which a second semiconductor substrate provided with a photoelectric conversion unit and a second element, a second insulating layer, a first semiconductor substrate provided with a first element, and a first insulating layer are arranged in this order from a light incident side, and which has a groove-like part formed on the first semiconductor substrate. The groove-like part has a first side wall and a second side wall, and a part of at least one side wall of the first side wall and the second side wall extends in an oblique direction with respect to a surface of the first semiconductor substrate on the light incident side.SELECTED DRAWING: Figure 3
【課題】固体撮像装置の更なる信頼性の向上や製造コストの更なる抑制を実現することができる固体撮像装置を提供すること。【解決手段】光入射側から順に、光電変換部と第２素子とが設けられた第２半導体基板と、第２絶縁層と、第１素子が設けられた第１半導体基板と、第１絶縁層とが配され、該第１半導体基板に形成された溝状部を有し、該溝状部が第１側壁と第２側壁とを有し、該第１側壁及び該第２側壁のうち少なくとも一方の側壁の一部が、該第１半導体基板の該光入射側の面に対して斜め方向に延在する、固体撮像装置を提供する。【選択図】図３</abstract><oa>free_for_read</oa></addata></record> |
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| subjects | BASIC ELECTRIC ELEMENTS ELECTRIC COMMUNICATION TECHNIQUE ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY PICTORIAL COMMUNICATION, e.g. TELEVISION SEMICONDUCTOR DEVICES |
| title | SOLID-STATE IMAGING DEVICE, METHOD FOR PRODUCING SOLID-STATE IMAGING DEVICE, AND ELECTRONIC DEVICE |
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