RESIN COMPOSITION FOR ENCAPSULATING SEMICONDUCTOR ELEMENT-MOUNTED FACE OF CIRCUIT BOARD MOUNTED WITH SEMICONDUCTOR ELEMENT, OR SEMICONDUCTOR ELEMENT-FORMED FACE OF WAFER FORMED WITH SEMICONDUCTOR ELEMENT, AND USE OF THE SAME

To provide an encapsulation resin composition favorable for application of encapsulating a semiconductor element-mounted face of a circuit board mounted with a semiconductor element, or a semiconductor element-formed face of a wafer formed with a semiconductor element, and excellent in low warpage property and grindability.SOLUTION: A resin composition for encapsulating a semiconductor element-mounted face of a circuit board mounted with a semiconductor element, or a semiconductor element-formed face of a wafer formed with a semiconductor element includes: (A) a maleimide compound having one or more hydrocarbon group(s) derived from a dimer acid skeleton in one molecule; (B) a reaction initiator; and (C) an inorganic filler subjected to surface treatment with a silane coupling agent, where the maximum particle size of the constituent (C) is 40 μm or less.SELECTED DRAWING: None 【課題】半導体素子を搭載した基板の半導体素子搭載面又は半導体素子を形成したウエハの半導体素子形成面を封止する用途に好適であり、低反り性、研削性に優れる封止樹脂組成物の提供。【解決手段】半導体素子を搭載した基板の半導体素子搭載面又は半導体素子を形成したウエハの半導体素子形成面を封止する樹脂組成物であって、（Ａ）１分子中にダイマー酸骨格由来の炭化水素基を１個以上有するマレイミド化合物（Ｂ）反応開始剤及び（Ｃ）シランカップリング剤で表面処理した無機充填材を含み、前記（Ｃ）成分の最大粒径が４０μｍ以下である封止樹脂組成物。【選択図】なし