CMP PAD HAVING POLISHING LAYER OF LOW SPECIFIC GRAVITY

To provide a polishing pad having a polishing layer with a low specific gravity and a unimodal pore size distribution.SOLUTION: A polishing pad comprises: a polishing layer that comprises a polymer matrix that is the reaction product of an isocyanate-terminated oligomer or polymer with a curative bl...

Ausführliche Beschreibung

Bibliographische Detailangaben

1. Verfasser:	CHIOU NAN-RONG
Format:	Patent
Sprache:	eng ; jpn
Schlagworte:	BASIC ELECTRIC ELEMENTS DRESSING OR CONDITIONING OF ABRADING SURFACES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS GRINDING MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING PERFORMING OPERATIONS POLISHING SEMICONDUCTOR DEVICES TRANSPORTING
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