MOLD CONVEYANCE DEVICE
To provide a mold conveyance device that can convey a mold at a high speed even if a small electric motor is used.SOLUTION: A mold conveyance device 1A conveys at least one set of molds DE that is obtained by combining a fixed mold DE1 and a movable mold DE2 along a conveyance direction. The mold co...
Gespeichert in:
1. Verfasser: | |
---|---|
Format: | Patent |
Sprache: | eng ; jpn |
Schlagworte: | |
Online-Zugang: | Volltext bestellen |
Tags: |
Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
|
Zusammenfassung: | To provide a mold conveyance device that can convey a mold at a high speed even if a small electric motor is used.SOLUTION: A mold conveyance device 1A conveys at least one set of molds DE that is obtained by combining a fixed mold DE1 and a movable mold DE2 along a conveyance direction. The mold conveyance device 1A comprises: a first conveyance section 20A that conveys the mold DE in the conveyance direction X while placing the mold DE; and a second conveyance section 40A that conveys the mold DE by moving the first conveyance section 20A in the conveyance direction X.SELECTED DRAWING: Figure 1
【課題】小型の電動モータを用いたとしても、金型を高速で搬送できる金型搬送装置を提供すること。【解決手段】金型搬送装置1Aは、固定金型DE1と可動金型DE2を組み合わせてなる少なくとも一組の金型DEを搬送方向に沿って搬送させる。金型搬送装置1Aは、金型DEを載せながら金型DEを搬送方向Xに搬送させる第1搬送部20Aと、第1搬送部20Aを搬送方向Xに移動させることで金型DEを搬送する第2搬送部40Aと、を備える。【選択図】図1 |
---|