MOLD CONVEYANCE DEVICE

To provide a mold conveyance device that can convey a mold at a high speed even if a small electric motor is used.SOLUTION: A mold conveyance device 1A conveys at least one set of molds DE that is obtained by combining a fixed mold DE1 and a movable mold DE2 along a conveyance direction. The mold co...

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1. Verfasser: KARIYA TOSHIHIKO
Format: Patent
Sprache:eng ; jpn
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Beschreibung
Zusammenfassung:To provide a mold conveyance device that can convey a mold at a high speed even if a small electric motor is used.SOLUTION: A mold conveyance device 1A conveys at least one set of molds DE that is obtained by combining a fixed mold DE1 and a movable mold DE2 along a conveyance direction. The mold conveyance device 1A comprises: a first conveyance section 20A that conveys the mold DE in the conveyance direction X while placing the mold DE; and a second conveyance section 40A that conveys the mold DE by moving the first conveyance section 20A in the conveyance direction X.SELECTED DRAWING: Figure 1 【課題】小型の電動モータを用いたとしても、金型を高速で搬送できる金型搬送装置を提供すること。【解決手段】金型搬送装置1Aは、固定金型DE1と可動金型DE2を組み合わせてなる少なくとも一組の金型DEを搬送方向に沿って搬送させる。金型搬送装置1Aは、金型DEを載せながら金型DEを搬送方向Xに搬送させる第1搬送部20Aと、第1搬送部20Aを搬送方向Xに移動させることで金型DEを搬送する第2搬送部40Aと、を備える。【選択図】図1