RACK PLATING APPARATUS

To provide an improved rack plating apparatus.SOLUTION: A rack plating apparatus comprises a machine frame 2, a mounted device 3, and a basin device 4. The machine frame includes a base 21, a plurality of electroplating tanks 22, and two rail frames 23. The mounted device includes a stage 31, a hori...

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Bibliographische Detailangaben
Hauptverfasser:	HUANG PO-TAO, LIU YAOUNG
Format:	Patent
Sprache:	eng ; jpn
Schlagworte:	APPARATUS THEREFOR CHEMISTRY ELECTROFORMING ELECTROLYTIC OR ELECTROPHORETIC PROCESSES METALLURGY PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTIONOF COATINGS
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Beschreibung
Zusammenfassung:	To provide an improved rack plating apparatus.SOLUTION: A rack plating apparatus comprises a machine frame 2, a mounted device 3, and a basin device 4. The machine frame includes a base 21, a plurality of electroplating tanks 22, and two rail frames 23. The mounted device includes a stage 31, a horizontal movement unit 32, a vertical movement unit 33, and a barrel unit. The basin device includes a basin, two moving side frames, and two horizontal transmission belts.SELECTED DRAWING: Figure 1 【課題】改良されたラックめっき機器を提供する。【解決手段】機台２と、搭載装置３と、水盤装置４とを含むラックめっき機器であって、前記機台は、台座２１と、複数の電気めっき槽２２と、２つのレールフレーム２３とを含み、前記搭載装置は、ステージ３１と、水平移動ユニット３２と、垂直移動ユニット３３と、バレルユニットとを含み、水盤装置は、水盤と、２つの移動側フレームと、２本の水平伝動ベルトとを有する。【選択図】図１