WIRING BOARD AND MANUFACTURING METHOD THEREOF
To provide a flexible wiring board and a manufacturing method thereof.SOLUTION: A wiring board includes a stretchable base material, a first silica aerogel layer provided on the stretchable substrate, a liquid metal layer provided on the first silica aerogel layer, and a stretchable insulation mater...
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| creator | SAKAGUCHI SHIGEKI |
| description | To provide a flexible wiring board and a manufacturing method thereof.SOLUTION: A wiring board includes a stretchable base material, a first silica aerogel layer provided on the stretchable substrate, a liquid metal layer provided on the first silica aerogel layer, and a stretchable insulation material sealing the first silica aerogel layer and the liquid metal layer.SELECTED DRAWING: Figure 7
【課題】柔軟性のある配線基板およびその製造方法を提供すること。【解決手段】伸縮性基材と、伸縮性基材上に設けられた第１のシリカエアロゲル層と、第１のシリカエアロゲル層上に設けられた液体金属層と、第１のシリカエアロゲル層と液体金属層を封止する伸縮性絶縁材とを備える、配線基板。【選択図】図７ |
| format | Patent |
| fullrecord | <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_JP2023177129A</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>JP2023177129A</sourcerecordid><originalsourceid>FETCH-epo_espacenet_JP2023177129A3</originalsourceid><addsrcrecordid>eNrjZNAN9wzy9HNXcPJ3DHJRcPRzUfB19At1c3QOCQWL-7qGePi7KIR4uAa5-rvxMLCmJeYUp_JCaW4GJTfXEGcP3dSC_PjU4oLE5NS81JJ4rwAjAyNjQ3NzQyNLR2OiFAEA_mkl2Q</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>WIRING BOARD AND MANUFACTURING METHOD THEREOF</title><source>esp@cenet</source><creator>SAKAGUCHI SHIGEKI</creator><creatorcontrib>SAKAGUCHI SHIGEKI</creatorcontrib><description>To provide a flexible wiring board and a manufacturing method thereof.SOLUTION: A wiring board includes a stretchable base material, a first silica aerogel layer provided on the stretchable substrate, a liquid metal layer provided on the first silica aerogel layer, and a stretchable insulation material sealing the first silica aerogel layer and the liquid metal layer.SELECTED DRAWING: Figure 7
【課題】柔軟性のある配線基板およびその製造方法を提供すること。【解決手段】伸縮性基材と、伸縮性基材上に設けられた第１のシリカエアロゲル層と、第１のシリカエアロゲル層上に設けられた液体金属層と、第１のシリカエアロゲル層と液体金属層を封止する伸縮性絶縁材とを備える、配線基板。【選択図】図７</description><language>eng ; jpn</language><subject>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS ; PRINTED CIRCUITS</subject><creationdate>2023</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20231213&DB=EPODOC&CC=JP&NR=2023177129A$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,780,885,25564,76547</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20231213&DB=EPODOC&CC=JP&NR=2023177129A$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>SAKAGUCHI SHIGEKI</creatorcontrib><title>WIRING BOARD AND MANUFACTURING METHOD THEREOF</title><description>To provide a flexible wiring board and a manufacturing method thereof.SOLUTION: A wiring board includes a stretchable base material, a first silica aerogel layer provided on the stretchable substrate, a liquid metal layer provided on the first silica aerogel layer, and a stretchable insulation material sealing the first silica aerogel layer and the liquid metal layer.SELECTED DRAWING: Figure 7
【課題】柔軟性のある配線基板およびその製造方法を提供すること。【解決手段】伸縮性基材と、伸縮性基材上に設けられた第１のシリカエアロゲル層と、第１のシリカエアロゲル層上に設けられた液体金属層と、第１のシリカエアロゲル層と液体金属層を封止する伸縮性絶縁材とを備える、配線基板。【選択図】図７</description><subject>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</subject><subject>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</subject><subject>PRINTED CIRCUITS</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2023</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZNAN9wzy9HNXcPJ3DHJRcPRzUfB19At1c3QOCQWL-7qGePi7KIR4uAa5-rvxMLCmJeYUp_JCaW4GJTfXEGcP3dSC_PjU4oLE5NS81JJ4rwAjAyNjQ3NzQyNLR2OiFAEA_mkl2Q</recordid><startdate>20231213</startdate><enddate>20231213</enddate><creator>SAKAGUCHI SHIGEKI</creator><scope>EVB</scope></search><sort><creationdate>20231213</creationdate><title>WIRING BOARD AND MANUFACTURING METHOD THEREOF</title><author>SAKAGUCHI SHIGEKI</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_JP2023177129A3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng ; jpn</language><creationdate>2023</creationdate><topic>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</topic><topic>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</topic><topic>PRINTED CIRCUITS</topic><toplevel>online_resources</toplevel><creatorcontrib>SAKAGUCHI SHIGEKI</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>SAKAGUCHI SHIGEKI</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>WIRING BOARD AND MANUFACTURING METHOD THEREOF</title><date>2023-12-13</date><risdate>2023</risdate><abstract>To provide a flexible wiring board and a manufacturing method thereof.SOLUTION: A wiring board includes a stretchable base material, a first silica aerogel layer provided on the stretchable substrate, a liquid metal layer provided on the first silica aerogel layer, and a stretchable insulation material sealing the first silica aerogel layer and the liquid metal layer.SELECTED DRAWING: Figure 7
【課題】柔軟性のある配線基板およびその製造方法を提供すること。【解決手段】伸縮性基材と、伸縮性基材上に設けられた第１のシリカエアロゲル層と、第１のシリカエアロゲル層上に設けられた液体金属層と、第１のシリカエアロゲル層と液体金属層を封止する伸縮性絶縁材とを備える、配線基板。【選択図】図７</abstract><oa>free_for_read</oa></addata></record> |
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| subjects | CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS |
| title | WIRING BOARD AND MANUFACTURING METHOD THEREOF |
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